Inventor · disambiguated record
Jeffrey D. Birdsley
Also filed as: BIRDSLEY JEFFREY · BIRDSLEY JEFFREY D · BIRDSLEY JEFFREY DAVID
44 granted patents·1 pending application·635 citations·filing 1998–2002
98Inventor score
Top patents by PatentIndex Score
45 records- 0195US6483327B1Quadrant avalanche photodiode time-resolved detectionADVANCED MICRO DEVICES INC·Filed 1999·Granted Nov 19, 2002·123 cites·22 claims
- 0288US6850081B1Semiconductor die analysis via fiber optic communicationADVANCED MICRO DEVICES INC·Filed 2002·Granted Feb 1, 2005·37 cites·7 claims
- 0380US6403388B1Nanomachining method for integrated circuitsADVANCED MICRO DEVICES INC·Filed 2001·Granted Jun 11, 2002·23 cites·20 claims
- 0479US6391664B1Selectively activatable solar cells for integrated circuit analysisADVANCED MICRO DEVICES INC·Filed 1999·Granted May 21, 2002·52 cites·19 claims
- 0579US6300148B1Semiconductor structure with a backside protective layer and backside probes and a method for constructing the structureADVANCED MICRO DEVICES INC·Filed 1998·Granted Oct 9, 2001·49 cites·24 claims
- 0671US7196800B1Semiconductor die analysis as a function of optical reflections from the dieADVANCED MICRO DEVICES INC·Filed 2002·Granted Mar 27, 2007·15 cites·21 claims
- 0770US6500699B1Test fixture for future integrationADVANCED MICRO DEVICES INC·Filed 2000·Granted Dec 31, 2002·14 cites·21 claims
- 0865US6448095B1Circuit access and analysis for a SOI flip-chip dieADVANCED MICRO DEVICES INC·Filed 2001·Granted Sep 10, 2002·9 cites·20 claims
- 0965US6417680B1Method and apparatus for stress testing a semiconductor device using laser-induced circuit excitationADVANCED MICRO DEVICES INC·Filed 1999·Granted Jul 9, 2002·24 cites·20 claims
- 1065US6387715B1Integrated circuit defect detection via laser heat and IR thermographyADVANCED MICRO DEVICES INC·Filed 1999·Granted May 14, 2002·27 cites·20 claims
- 1164US6281025B1Substrate removal as a function of SIMS analysisADVANCED MICRO DEVICES INC·Filed 1999·Granted Aug 28, 2001·28 cites·21 claims
- 1260US6864972B1IC die analysis via back side lensADVANCED MICRO DEVICES INC·Filed 2002·Granted Mar 8, 2005·2 cites·20 claims
- 1357US6621281B1SOI die analysis of circuitry logic states via coupling through the insulatorADVANCED MICRO DEVICES INC·Filed 2001·Granted Sep 16, 2003·7 cites·21 claims
- 1457US6518783B1Circuit construction in back side of die and over a buried insulatorADVANCED MICRO DEVICES INC·Filed 2001·Granted Feb 11, 2003·7 cites·22 claims
- 1557US6414335B1Selective state change analysis of a SOI dieADVANCED MICRO DEVICES INC·Filed 2001·Granted Jul 2, 2002·7 cites·20 claims
- 1656US6210981B1Method for etching a flip chip using secondary particle emissions to detect the etch end-pointADVANCED MICRO DEVICES INC·Filed 1999·Granted Apr 3, 2001·20 cites·14 claims
- 1753US6686757B1Defect detection in semiconductor devicesADVANCED MICRO DEVICES INC·Filed 1999·Granted Feb 3, 2004·16 cites·16 claims
- 1853US6576484B1IC die analysis via back side circuit construction with heat dissipationADVANCED MICRO DEVICES INC·Filed 2001·Granted Jun 10, 2003·5 cites·20 claims
- 1953US6430728B1Acoustic 3D analysis of circuit structuresADVANCED MICRO DEVICES INC·Filed 1999·Granted Aug 6, 2002·16 cites·22 claims
- 2053US6255124B1Test arrangement and method for thinned flip chip ICADVANCED MICRO DEVICES INC·Filed 1999·Granted Jul 3, 2001·15 cites·20 claims
- 2150US7019511B1Optical analysis of integrated circuitsADVANCED MICRO DEVICES INC·Filed 2001·Granted Mar 28, 2006·4 cites·9 claims
- 2250US6417068B1Semiconductor device navigation using laser scribingADVANCE MICRO DEVICES INC·Filed 1999·Granted Jul 9, 2002·13 cites·15 claims
- 2349US6472760B1Nanomachining of integrated circuitsADVANCED MICRO DEVICES INC·Filed 2001·Granted Oct 29, 2002·3 cites·1 claims
- 2449US6303396B1Substrate removal as a function of resistance at the back side of a semiconductor deviceADVANCED MICRO DEVICES INC·Filed 1999·Granted Oct 16, 2001·13 cites·20 claims
- 2548US6428718B1Selective back side wet etchADVANCED MICRO DEVICES INC·Filed 1999·Granted Aug 6, 2002·12 cites·19 claims
- 2646US6281029B1Probe points for heat dissipation during testing of flip chip ICADVANCED MICRO DEVICES INC·Filed 1999·Granted Aug 28, 2001·11 cites·21 claims
- 2746US6277659B1Substrate removal using thermal analysisADVANCED MICRO DEVICES INC·Filed 1999·Granted Aug 21, 2001·11 cites·20 claims
- 2844US6448096B1Atomic force microscopy and signal acquisition via buried insulatorADVANCED MICRO DEVICES INC·Filed 2001·Granted Sep 10, 2002·2 cites·24 claims
- 2939US6388334B1System and method for circuit rebuilding via backside accessADVANCED MICRO DEVICES INC·Filed 1999·Granted May 14, 2002·7 cites·20 claims
- 3039US6248600B1Led in substrate with back side monitoringADVANCED MICRO DEVICES INC·Filed 1999·Granted Jun 19, 2001·6 cites·20 claims
- 3138US6529029B1Magnetic resonance imaging of semiconductor devicesADVANCED MICRO DEVICES INC·Filed 1999·Granted Mar 4, 2003·6 cites·20 claims
- 3237US6421811B1Defect detection via acoustic analysisADVANCED MICRO DEVICES INC·Filed 1999·Granted Jul 16, 2002·4 cites·19 claims
- 3336US6806166B1Substrate removal as a function of emitted photons at the back side of a semiconductor chipADVANCED MICRO DEVICES INC·Filed 1999·Granted Oct 19, 2004·4 cites·19 claims
- 3436US6352871B1Probe grid for integrated circuit excitationADVANCED MICRO DEVICES INC·Filed 1999·Granted Mar 5, 2002·5 cites·30 claims
- 3536US6281028B1LED alignment points for semiconductor dieADVANCED MICRO DEVICES INC·Filed 1999·Granted Aug 28, 2001·5 cites·21 claims
- 3635US6720641B1Semiconductor structure having backside probe points for direct signal access from active and well regionsADVANCED MICRO DEVICES INC·Filed 1998·Granted Apr 13, 2004·5 cites·23 claims
- 3735US6455334B1Probe grid for integrated circuit analysisADVANCED MICRO DEVICES INC·Filed 1999·Granted Sep 24, 2002·4 cites·24 claims
- 3835US6350624B1Substrate removal as a functional of sonic analysisADVANCED MICRO DEVICES INC·Filed 1999·Granted Feb 26, 2002·3 cites·9 claims
- 3935US6277656B1Substrate removal as a function of acoustic analysisFiled 1999·Granted Aug 21, 2001·4 cites·15 claims
- 4035US2002084792A1SOI die analysis of circuitry logic states via coupling through the insulatorADVANCED MICRO DEVICES INC·Filed 2000·Application pending·0 cites
- 4134US6294395B1Back side reactive ion etchADVANCED MICRO DEVICES INC·Filed 1999·Granted Sep 25, 2001·6 cites·18 claims
- 4233US6433572B1Intergrated circuit integrity analysis as a function of magnetic field decayADVANCED MICRO DEVICES INC·Filed 1999·Granted Aug 13, 2002·3 cites·15 claims
- 4333US6372529B1Forming elongated probe points useful in testing semiconductor devicesADVANCED MICRO DEVICES INC·Filed 1999·Granted Apr 16, 2002·3 cites·20 claims
- 4433US6300145B1Ion implantation and laser anneal to create n-doped structures in siliconADVANCED MICRO DEVICES INC·Filed 1999·Granted Oct 9, 2001·3 cites·21 claims
- 4529US6355564B1Selective back side reactive ion etchADVANCED MICRO DEVICES INC·Filed 1999·Granted Mar 12, 2002·2 cites·18 claims
Join the waitlist — get patent alerts
Get an alert when Jeffrey D. Birdsley files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →