Inventor · disambiguated record
Jeffrey S. Braden
Also filed as: BRADEN JEFFREY · BRADEN JEFFREY S
18 granted patents·1,287 citations·filing 1989–2017
96Inventor score
Files withOLIN CORP13ADVANCED INTERCONNECT TECH LTD2ADVANCED TECHNOLOGY INTERCONNE1BRADEN JEFFREY S1NORTHROP GRUMMAN SYSTEMS CORP1
Top patents by PatentIndex Score
18 records- 0198US5608267AMolded plastic semiconductor package including heat spreaderOLIN CORP·Filed 1994·Granted Mar 4, 1997·339 cites·20 claims
- 0292US5629835AMetal ball grid array package with improved thermal conductivityOLIN CORP·Filed 1994·Granted May 13, 1997·138 cites·13 claims
- 0392US5367196AMolded plastic semiconductor package including an aluminum alloy heat spreaderOLIN CORP·Filed 1992·Granted Nov 22, 1994·131 cites·29 claims
- 0488US8148808B2Partitioning of electronic packagesBRADEN JEFFREY S·Filed 2008·Granted Apr 3, 2012·31 cites·13 claims
- 0587US5073521AMethod for housing a tape-bonded electronic device and the package employedOLIN CORP·Filed 1989·Granted Dec 17, 1991·76 cites·17 claims
- 0687US5025114AMulti-layer lead frames for integrated circuit packagesOLIN CORP·Filed 1989·Granted Jun 18, 1991·76 cites·32 claims
- 0786US11104459B2Systems for capturing a client vehicleNORTHROP GRUMMAN SYSTEMS CORP·Filed 2017·Granted Aug 31, 2021·7 cites·20 claims
- 0886US6262477B1Ball grid array electronic packageADVANCED INTERCONNECT TECH LTD·Filed 1993·Granted Jul 17, 2001·88 cites·28 claims
- 0984US5399805AMetal electronic package with reduced seal widthOLIN CORP·Filed 1993·Granted Mar 21, 1995·66 cites·19 claims
- 1082US5043534AMetal electronic package having improved resistance to electromagnetic interferenceOLIN CORP·Filed 1990·Granted Aug 27, 1991·76 cites·38 claims
- 1181US6300673B1Edge connectable metal packageADVANCED INTERCONNECT TECH LTD·Filed 1995·Granted Oct 9, 2001·56 cites·17 claims
- 1276US5504372AAdhesively sealed metal electronic package incorporating a multi-chip moduleOLIN CORP·Filed 1994·Granted Apr 2, 1996·44 cites·10 claims
- 1375US5324888AMetal electronic package with reduced seal widthOLIN CORP·Filed 1992·Granted Jun 28, 1994·45 cites·34 claims
- 1474US5013871AKit for the assembly of a metal electronic packageOLIN CORP·Filed 1990·Granted May 7, 1991·50 cites·15 claims
- 1552US4970781AProcess plate for plastic pin grid array manufacturingOLIN CORP·Filed 1989·Granted Nov 20, 1990·18 cites·37 claims
- 1651US5132773ACarrier ring having first and second ring means with bonded surfacesOLIN CORP·Filed 1991·Granted Jul 21, 1992·20 cites·12 claims
- 1745US5234536AProcess for the manufacture of an interconnect circuitOLIN CORP·Filed 1992·Granted Aug 10, 1993·14 cites·15 claims
- 1841US5952083AAluminum alloys for electronic componentsADVANCED TECHNOLOGY INTERCONNE·Filed 1997·Granted Sep 14, 1999·12 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →