Inventor · disambiguated record
Jens Brandenburg
Also filed as: BRANDENBURG JENS
4 granted patents·2 citations·filing 2017–2023
58Inventor score
Files withINFINEON TECHNOLOGIES AG4
Top patents by PatentIndex Score
4 records- 0173US10388722B2Power semiconductor device termination structureINFINEON TECHNOLOGIES AG·Filed 2017·Granted Aug 20, 2019·2 cites·20 claims
- 0272US12183696B2Semiconductor device including bonding pad metal layer structureINFINEON TECHNOLOGIES AG·Filed 2023·Granted Dec 31, 2024·0 cites·25 claims
- 0363US11764176B2Semiconductor device including bonding pad metal layer structureINFINEON TECHNOLOGIES AG·Filed 2021·Granted Sep 19, 2023·0 cites·18 claims
- 0441US11387359B2Ppower semiconductor device with anticorrosive edge termination structureINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jul 12, 2022·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →