Inventor · disambiguated record
Jerry M. Brooks
Also filed as: BROOKS JERRY M · BROOKS JERRY MICHAEL
170 granted patents·18 pending applications·9,142 citations·filing 1991–2011
99Inventor score
Top patents by PatentIndex Score
188 records- 0199US6900528B2Stacked mass storage flash memory packageMICRON TECHNOLOGY INC·Filed 2001·Granted May 31, 2005·229 cites·21 claims
- 0299US6583503B2Semiconductor package with stacked substrates and multiple semiconductor diceMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 24, 2003·275 cites·27 claims
- 0399US6326244B1Method of making a cavity ball grid array apparatusMICRON TECHNOLOGY INC·Filed 2000·Granted Dec 4, 2001·376 cites·92 claims
- 0499US6258623B1Low profile multi-IC chip package connectorMICRON TECHNOLOGY INC·Filed 1999·Granted Jul 10, 2001·354 cites·7 claims
- 0599US6225689B1Low profile multi-IC chip package connectorMICRON TECHNOLOGY INC·Filed 2000·Granted May 1, 2001·295 cites·64 claims
- 0699US6084297ACavity ball grid array apparatusMICRON TECHNOLOGY INC·Filed 1998·Granted Jul 4, 2000·319 cites·53 claims
- 0799US6072233AStackable ball grid array packageMICRON TECHNOLOGY INC·Filed 1998·Granted Jun 6, 2000·579 cites·54 claims
- 0899US6051878AMethod of constructing stacked packagesMICRON TECHNOLOGY INC·Filed 1999·Granted Apr 18, 2000·422 cites·32 claims
- 0999US5994166AMethod of constructing stacked packagesMICRON TECHNOLOGY INC·Filed 1997·Granted Nov 30, 1999·339 cites·6 claims
- 1099US5677566ASemiconductor chip packageMICRON TECHNOLOGY INC·Filed 1995·Granted Oct 14, 1997·550 cites·18 claims
- 1198US6313522B1Semiconductor structure having stacked semiconductor devicesMICRON TECHNOLOGY INC·Filed 1998·Granted Nov 6, 2001·216 cites·43 claims
- 1298US6159764AVaried-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packagesMICRON TECHNOLOGY INC·Filed 1997·Granted Dec 12, 2000·283 cites·1 claims
- 1398US6148509AMethod for supporting an integrated circuit dieMICRON TECHNOLOGY INC·Filed 1998·Granted Nov 21, 2000·221 cites·2 claims
- 1498US5973935AInterdigitated leads-over-chip lead frame for supporting an integrated circuit dieMICRON TECHNOLOGY INC·Filed 1998·Granted Oct 26, 1999·202 cites·15 claims
- 1597US7704794B2Method of forming a semiconductor deviceMICRON TECHNOLOGY INC·Filed 2006·Granted Apr 27, 2010·43 cites·54 claims
- 1697US6429528B1Multichip semiconductor packageMICRON TECHNOLOGY INC·Filed 1998·Granted Aug 6, 2002·194 cites·19 claims
- 1797US6284571B1Lead frame assemblies with voltage reference plane and IC packages including sameMICRON TECHNOLOGY INC·Filed 1999·Granted Sep 4, 2001·190 cites·27 claims
- 1897US6222265B1Method of constructing stacked packagesMICRON TECHNOLOGY INC·Filed 1999·Granted Apr 24, 2001·201 cites·32 claims
- 1997US6140154AMulti-part lead frame with dissimilar materials and method of manufacturingMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 31, 2000·152 cites·15 claims
- 2097US6072228AMulti-part lead frame with dissimilar materials and method of manufacturingMICRON TECHNOLOGY INC·Filed 1996·Granted Jun 6, 2000·201 cites·73 claims
- 2196US7262506B2Stacked mass storage flash memory packageMICRON TECHNOLOGY INC·Filed 2003·Granted Aug 28, 2007·85 cites·88 claims
- 2296US6965160B2Semiconductor dice packages employing at least one redistribution layerMICRON TECHNOLOGY INC·Filed 2002·Granted Nov 15, 2005·102 cites·44 claims
- 2396US6686655B2Low profile multi-IC chip package connectorMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 3, 2004·45 cites·60 claims
- 2496US6486546B2Low profile multi-IC chip package connectorMICRON TECHNOLOGY INC·Filed 2002·Granted Nov 26, 2002·47 cites·60 claims
- 2596US6344976B1Interdigitated leads-over-chip lead frame device and method for supporting an integrated circuit dieMICRON TECHNOLOGY INC·Filed 1999·Granted Feb 5, 2002·202 cites·20 claims
- 2695US6531338B2Method of manufacturing a semiconductor structure having stacked semiconductor devicesMICRON TECHNOLOGY INC·Filed 2002·Granted Mar 11, 2003·69 cites·27 claims
- 2795US6404044B2Semiconductor package with stacked substrates and multiple semiconductor diceMICRON TECHNOLOGY INC·Filed 2001·Granted Jun 11, 2002·64 cites·30 claims
- 2895US6268649B1Stackable ball grid array packageMICRON TECHNOLOGY INC·Filed 2000·Granted Jul 31, 2001·73 cites·51 claims
- 2995US6228548B1Method of making a multichip semiconductor packageMICRON TECHNOLOGY INC·Filed 2000·Granted May 8, 2001·284 cites·28 claims
- 3094US7061092B2High-density modularity for ICSMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 13, 2006·76 cites·38 claims
- 3194US6979895B2Semiconductor assembly of stacked substrates and multiple semiconductor diceMICRON TECHNOLOGY INC·Filed 2003·Granted Dec 27, 2005·58 cites·29 claims
- 3294US6897096B2Method of packaging semiconductor dice employing at least one redistribution layerMICRON TECHNOLOGY INC·Filed 2003·Granted May 24, 2005·64 cites·53 claims
- 3394US6215177B1Tape under frame for conventional-type IC package assemblyMICRON TECHNOLOGY INC·Filed 2000·Granted Apr 10, 2001·49 cites·60 claims
- 3493US6531339B2Redundancy mapping in a multichip semiconductor packageMICRON TECHNOLOGY INC·Filed 2001·Granted Mar 11, 2003·62 cites·26 claims
- 3593US5140405ASemiconductor assembly utilizing elastomeric single axis conductive interconnectMICRON TECHNOLOGY INC·Filed 1991·Granted Aug 18, 1992·181 cites·15 claims
- 3692US6656767B1Method of forming a stack of packaged memory diceMICRON TECHNOLOGY INC·Filed 2002·Granted Dec 2, 2003·41 cites·13 claims
- 3791US6455928B2Stackable ball grid array packageMICRON TECHNOLOGY INC·Filed 2001·Granted Sep 24, 2002·41 cites·51 claims
- 3891US6153929ALow profile multi-IC package connectorMICRON TECHNOLOGY INC·Filed 1998·Granted Nov 28, 2000·46 cites·64 claims
- 3990US6531337B1Method of manufacturing a semiconductor structure having stacked semiconductor devicesMICRON TECHNOLOGY INC·Filed 2000·Granted Mar 11, 2003·41 cites·21 claims
- 4089US7091061B2Method of forming a stack of packaged memory diceMICRON TECHNOLOGY INC·Filed 2005·Granted Aug 15, 2006·10 cites·13 claims
- 4189US7084514B2Multi-chip module and methodsMICRON TECHNOLOGY INC·Filed 2005·Granted Aug 1, 2006·13 cites·22 claims
- 4289US6603198B2Semiconductor structure having stacked semiconductor devicesMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 5, 2003·34 cites·31 claims
- 4389US5729049ATape under frame for conventional-type IC package assemblyMICRON TECHNOLOGY INC·Filed 1996·Granted Mar 17, 1998·60 cites·60 claims
- 4488US7999378B2Semiconductor devices including semiconductor dice in laterally offset stacked arrangementROUND ROCK RES LLC·Filed 2010·Granted Aug 16, 2011·6 cites·41 claims
- 4588US6207474B1Method of forming a stack of packaged memory die and resulting apparatusMICRON TECHNOLOGY INC·Filed 1998·Granted Mar 27, 2001·56 cites·13 claims
- 4688US5440241AMethod for testing, burning-in, and manufacturing wafer scale integrated circuits and a packaged wafer assembly produced therebyMICRON TECHNOLOGY INC·Filed 1992·Granted Aug 8, 1995·118 cites·5 claims
- 4787US6979596B2Method of fabricating a tape having apertures under a lead frame for conventional IC packagesMICRON TECHNOLOGY INC·Filed 2002·Granted Dec 27, 2005·27 cites·40 claims
- 4887US6438045B1Redundancy mapping in a multichip semiconductor packageMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 20, 2002·35 cites·21 claims
- 4987US6228677B1Vertical surface mount assembly and methodsMICRON TECHNOLOGY INC·Filed 2000·Granted May 8, 2001·19 cites·19 claims
- 5087US5616953ALead frame surface finish enhancementMICRON TECHNOLOGY INC·Filed 1994·Granted Apr 1, 1997·88 cites·24 claims
Showing the top 50 of 188 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Jerry M. Brooks files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →