Inventor · disambiguated record
Jen-Yu Chen
Also filed as: CHEN JEN-YU
6 granted patents·2 pending applications·14 citations·filing 2011–2020
75Inventor score
Top patents by PatentIndex Score
8 records- 0173US9685402B2Semiconductor device and method of forming recesses in conductive layer to detect continuity for interconnect between semiconductor die and substrateCHEN JEN YU·Filed 2011·Granted Jun 20, 2017·5 cites·24 claims
- 0273US8741764B2Semiconductor device and method of forming conductive pillars having recesses or protrusions to detect interconnect continuity between semiconductor die and substrateCHEN JEN YU·Filed 2011·Granted Jun 3, 2014·5 cites·25 claims
- 0370US9478513B2Semiconductor device with conductive pillars having recesses or protrusions to detect interconnect continuity between semiconductor die and substrateSTATS CHIPPAC LTD·Filed 2014·Granted Oct 25, 2016·3 cites·25 claims
- 0466US10213758B2Polymer and dispersionIND TECH RES INST·Filed 2016·Granted Feb 26, 2019·1 cites·9 claims
- 0549US2021070925A1Aqueous polymer, dispersion, and aqueous paintIND TECH RES INST·Filed 2020·Application pending·0 cites
- 0646US2021070947A1Aqueous polymer, dispersion, and aqueous paintIND TECH RES INST·Filed 2019·Application pending·0 cites
- 0743US9976898B2Optical sensing module with multi-directional optical sensing functionPIXART IMAGING INC·Filed 2016·Granted May 22, 2018·0 cites·21 claims
- 0841US9627286B1Package structurePIXART IMAGING INC·Filed 2016·Granted Apr 18, 2017·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →