Inventor · disambiguated record
Jee Won Chung
Also filed as: CHUNG JEE-WON
2 granted patents·1 pending application·0 citations·filing 2005–2021
28Inventor score
Top patents by PatentIndex Score
3 records- 0163US11784100B2Method of manufacturing a molded flip chip package to facilitate electrical testingSK HYNIX INC·Filed 2021·Granted Oct 10, 2023·0 cites·10 claims
- 0255US11177184B2Method of manufacturing a flip chip package and an apparatus for testing flip chipsSK HYNIX INC·Filed 2019·Granted Nov 16, 2021·0 cites·12 claims
- 0329US2006132986A1Magnetoresistance device and method of fabrication using titanium nitride as capping layerHWANG SOON-WON·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →