Inventor · disambiguated record
Jean Dery
Also filed as: DERY JEAN · DERY JEAN-MARC
6 granted patents·247 citations·filing 1997–2000
87Inventor score
Top patents by PatentIndex Score
6 records- 0189US6104093AThermally enhanced and mechanically balanced flip chip package and method of formingIBM·Filed 1998·Granted Aug 15, 2000·92 cites·15 claims
- 0288US6410988B1Thermally enhanced and mechanically balanced flip chip package and method of formingIBM·Filed 2000·Granted Jun 25, 2002·45 cites·18 claims
- 0384US6074895AMethod of forming a flip chip assemblyIBM·Filed 1997·Granted Jun 13, 2000·63 cites·14 claims
- 0466US6306683B1Method of forming a flip chip assembly, and a flip chip assembly formed by the methodIBM·Filed 2000·Granted Oct 23, 2001·16 cites·42 claims
- 0558US6348738B1Flip chip assemblyIBM·Filed 1999·Granted Feb 19, 2002·17 cites·7 claims
- 0639US6618797B1Device and method for protection against stack overflow and franking machine using sameSECAP·Filed 1999·Granted Sep 9, 2003·14 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →