Inventor · disambiguated record
Jeng-Gong Duh
Also filed as: DUH JENG-GONG
1 granted patent·2 pending applications·6 citations·filing 2004–2011
28Inventor score
Top patents by PatentIndex Score
3 records- 0146US7291201B2Method for making nano-scale lead-free solderUNIV TSINGHUA·Filed 2004·Granted Nov 6, 2007·6 cites·4 claims
- 0238US2011147950A1Metallization layer structure for flip chip packageTAI FONG-CHENG·Filed 2009·Application pending·0 cites
- 0332US2012205778A1Package structure and method for manufacturing the sameLAI YUAN-TAI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →