Inventor · disambiguated record
Jeremy Ecton
Also filed as: ECTON JEREMY · ECTON JEREMY D
39 granted patents·173 pending applications·6 citations·filing 2017–2024
94Inventor score
Top patents by PatentIndex Score
212 records- 0185US12422615B2Nested glass packaging architecture for hybrid electrical and optical communication devicesINTEL CORP·Filed 2021·Granted Sep 23, 2025·1 cites·11 claims
- 0283US12224103B2Angled inductor with small form factorINTEL CORP·Filed 2021·Granted Feb 11, 2025·1 cites·9 claims
- 0382US11081768B2Fabricating an RF filter on a semiconductor package using selective seedingINTEL CORP·Filed 2019·Granted Aug 3, 2021·2 cites·21 claims
- 0475US11791228B2Method for forming embedded grounding planes on interconnect layersINTEL CORP·Filed 2019·Granted Oct 17, 2023·2 cites·17 claims
- 0574US2025125307A1Microelectronic assemblies including interconnects with different solder materialsINTEL CORP·Filed 2024·Application pending·0 cites
- 0669US11721631B2Via structures having tapered profiles for embedded interconnect bridge substratesINTEL CORP·Filed 2022·Granted Aug 8, 2023·0 cites·25 claims
- 0767US11605867B2Fabricating an RF filter on a semiconductor package using selective seedingINTEL CORP·Filed 2021·Granted Mar 14, 2023·0 cites·20 claims
- 0866US12412868B2Microelectronic assemblies including interconnects with different solder materialsINTEL CORP·Filed 2021·Granted Sep 9, 2025·0 cites·20 claims
- 0966US11652071B2Electronic device package including a capacitorINTEL CORP·Filed 2021·Granted May 16, 2023·0 cites·5 claims
- 1064US12444672B2Hybrid bonding technologies with thermal expansion compensation structuresINTEL CORP·Filed 2022·Granted Oct 14, 2025·0 cites·19 claims
- 1164US12306480B2Glass interposer optical resonator device and methodINTEL CORP·Filed 2021·Granted May 20, 2025·0 cites·15 claims
- 1264US11528811B2Method, device and system for providing etched metallization structuresINTEL CORP·Filed 2021·Granted Dec 13, 2022·0 cites·20 claims
- 1363US12353070B2Glass interposer optical switching device and methodINTEL CORP·Filed 2021·Granted Jul 8, 2025·0 cites·15 claims
- 1462US2025004380A1Conditioning semiconductor processing solutions for reuseINTEL CORP·Filed 2023·Application pending·0 cites
- 1562US2025006570A1Glass cores including multiple layers and related methodsINTEL CORP·Filed 2024·Application pending·0 cites
- 1661US2024355749A1Disaggregated package substrates with glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 1761US2025022786A1Methods and apparatus for edge protected glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 1861US2024347402A1Methods and apparatus to reduce delamination in hybrid coresINTEL CORP·Filed 2024·Application pending·0 cites
- 1961US2025105074A1Glass cores including protruding through glass vias and related methodsINTEL CORP·Filed 2024·Application pending·0 cites
- 2061US2025309149A1Microelectronic structures including embedded etch stop in package coreINTEL CORP·Filed 2024·Application pending·0 cites
- 2160US2025279342A1Metal seed layers with different sheet resistances in integrated circuit packagesINTEL CORP·Filed 2024·Application pending·0 cites
- 2260US2025391716A1Riveted edge core for semiconductor packagingINTEL CORP·Filed 2024·Application pending·0 cites
- 2359US2025218965A1Self alignment structures for interconnect bridgesINTEL CORP·Filed 2023·Application pending·0 cites
- 2459US2025218982A1Technologies for ceramic components embedded in a substrate coreINTEL CORP·Filed 2023·Application pending·0 cites
- 2559US2025149455A1Integrated circuit packages including glass-cored substrates with self-aligned through glass viasINTEL CORP·Filed 2023·Application pending·0 cites
- 2659US2025210495A1Microelectronic assemblies with selective metallization for glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 2759US2024105571A1Implantation of species on glass core surface for low loss and high strength applicationsINTEL CORP·Filed 2022·Application pending·0 cites
- 2859US2025218905A1Component coupled with conductive vias encapsulated in an electronic substrateINTEL CORP·Filed 2023·Application pending·0 cites
- 2959US2025309015A1Integrated circuit packages including a glass-core substrate with ultra-high aspect ratio through-glass viasINTEL CORP·Filed 2024·Application pending·0 cites
- 3059US2025300086A1Optical and electrical glass interposer with embedded bridgeINTEL CORP·Filed 2024·Application pending·0 cites
- 3159US2025300088A1Integrated circuit packages including interposers having a glass layer and embedded diesINTEL CORP·Filed 2024·Application pending·0 cites
- 3258US12394719B2Methods and apparatus to increase glass core thicknessINTEL CORP·Filed 2021·Granted Aug 19, 2025·0 cites·23 claims
- 3358US2025062206A1Package architecture with bridge dies having air gaps around viasINTEL CORP·Filed 2023·Application pending·0 cites
- 3458US2025218962A1Technologies for a stack of components embedded in a substrate coreINTEL CORP·Filed 2023·Application pending·0 cites
- 3558US2025218898A1Reconstituted passive with mechanical support structuresINTEL CORP·Filed 2023·Application pending·0 cites
- 3658US2025125201A1Package substrates with components included in cavities of glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 3758US2025126814A1Package substrates with components included in cavities of glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 3858US2025125202A1Package substrates with components included in cavities of glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 3958US2025120102A1Package substrates with components included in cavities of glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 4058US2025079266A1Package architecture with package substrate having blind cavity with routing on sidewallsINTEL CORP·Filed 2023·Application pending·0 cites
- 4158US2025096143A1Microelectronic assembly with bridge die and selective metallization layersINTEL CORP·Filed 2023·Application pending·0 cites
- 4258US2025218998A1Low temperature solder interconnect for package pitch scalingINTEL CORP·Filed 2023·Application pending·0 cites
- 4358US2025266395A1Multi-die bridge assemblies and methods for three-dimensional packagingINTEL CORP·Filed 2024·Application pending·0 cites
- 4458US2025112100A1Die embedded in glass layer with two-side connectivityINTEL CORP·Filed 2023·Application pending·0 cites
- 4557US12449600B2Position controlled waveguides and methods of manufacturing the sameINTEL CORP·Filed 2021·Granted Oct 21, 2025·0 cites·25 claims
- 4657US12354883B2Omni directional interconnect with magnetic fillers in mold matrixINTEL CORP·Filed 2021·Granted Jul 8, 2025·0 cites·18 claims
- 4757US2025219028A1Deep trench capacitors in multi-core integrated circuit device package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 4857US2025149421A1Integrated circuit packages including glass-cored substrates with self-aligned through glass viasINTEL CORP·Filed 2023·Application pending·0 cites
- 4957US2025096053A1Microelectronic assemblies having a bridge die over a glass patchINTEL CORP·Filed 2023·Application pending·0 cites
- 5057US2025218963A1Die and conductive vias embedded in a substrateINTEL CORP·Filed 2023·Application pending·0 cites
Showing the top 50 of 212 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →