Inventor · disambiguated record
Jeffrey Toh Tuck Fook
Also filed as: FOOK JEFFREY TOH TUCK
14 granted patents·509 citations·filing 2000–2006
95Inventor score
Technology areasH10W
Files withMICRON TECHNOLOGY INC14
Top patents by PatentIndex Score
14 records- 0198US6522018B1Ball grid array chip packages having improved testing and stacking characteristicsMICRON TECHNOLOGY INC·Filed 2000·Granted Feb 18, 2003·244 cites·42 claims
- 0295US6420789B1Ball grid array chip packages having improved testing and stacking characteristicsMICRON TECHNOLOGY INC·Filed 2001·Granted Jul 16, 2002·72 cites·8 claims
- 0391US6693363B2Ball grid array chip packages having improved testing and stacking characteristicsMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 17, 2004·38 cites·8 claims
- 0491US6448664B1Ball grid array chip packages having improved testing and stacking characteristicsMICRON TECHNOLOGY INC·Filed 2001·Granted Sep 10, 2002·37 cites·24 claims
- 0585US6600335B2Method for ball grid array chip packages having improved testing and stacking characteristicsMICRON TECHNOLOGY INC·Filed 2001·Granted Jul 29, 2003·23 cites·7 claims
- 0677US7116122B2Method for ball grid array chip packages having improved testing and stacking characteristicsMICRON TECHNOLOGY INC·Filed 2005·Granted Oct 3, 2006·4 cites·21 claims
- 0777US6903449B2Semiconductor component having chip on board leadframeMICRON TECHNOLOGY INC·Filed 2003·Granted Jun 7, 2005·20 cites·48 claims
- 0876US6740984B2Ball grid array chip packages having improved testing and stacking characteristicsMICRON TECHNOLOGY INC·Filed 2003·Granted May 25, 2004·12 cites·20 claims
- 0974US6740983B2Method for ball grind array chip packages having improved testing and stacking characteristicsMICRON TECHNOLOGY INC·Filed 2002·Granted May 25, 2004·11 cites·32 claims
- 1074US6674175B2Ball grid array chip packages having improved testing and stacking characteristicsMICRON TECHNOLOGY INC·Filed 2002·Granted Jan 6, 2004·11 cites·8 claims
- 1174US6522019B2Ball grid array chip packages having improved testing and stacking characteristicsMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 18, 2003·11 cites·8 claims
- 1273US7049173B2Method for fabricating semiconductor component with chip on board leadframeMICRON TECHNOLOGY INC·Filed 2004·Granted May 23, 2006·15 cites·27 claims
- 1369US6847220B2Method for ball grid array chip packages having improved testing and stacking characteristicsMICRON TECHNOLOGY INC·Filed 2003·Granted Jan 25, 2005·8 cites·7 claims
- 1468US7459778B2Chip on board leadframe for semiconductor components having area arrayMICRON TECHNOLOGY INC·Filed 2006·Granted Dec 2, 2008·3 cites·28 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →