Inventor · disambiguated record
Jeongoh Ha
Also filed as: HA JEONGOH
1 granted patent·3 pending applications·7 citations·filing 2011–2024
28Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0176US8952517B2Package-on-package device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Feb 10, 2015·7 cites·9 claims
- 0255US2025096208A1Semiconductor package having dielectric layer with step differenceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0354US2024290669A1Semiconductor structure and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0434US2012074595A1Semiconductor packageHA JEONGOH·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →