Inventor · disambiguated record
Jerwei Hsieh
Also filed as: HSIEH JERWEI
8 granted patents·3 pending applications·23 citations·filing 2002–2016
82Inventor score
Files withASIA PACIFIC MICROSYSTEMS INC4WALSIN LIHWA CORP4INSTR TECHNOLOGY RES CT2INSTR TECHNOLOGY RES CT NAT AP1
Top patents by PatentIndex Score
11 records- 0164US9359193B2Method for manufacturing an integrated MEMS deviceASIA PACIFIC MICROSYSTEMS INC·Filed 2014·Granted Jun 7, 2016·1 cites·14 claims
- 0262US7180144B2Corner compensation method for fabricating MEMS and structure thereofWALSIN LIHWA CORP·Filed 2005·Granted Feb 20, 2007·1 cites·12 claims
- 0361US8916449B2Package structure and substrate bonding methodASIA PACIFIC MICROSYSTEMS INC·Filed 2013·Granted Dec 23, 2014·2 cites·8 claims
- 0457US7247247B2Selective etching methodWALSIN LIHWA CORP·Filed 2004·Granted Jul 24, 2007·10 cites·18 claims
- 0556US7088030B2High-aspect-ratio-microstructure (HARM)WALSIN LIHWA CORP·Filed 2004·Granted Aug 8, 2006·7 cites·19 claims
- 0655US9676609B2Integrated MEMS deviceASIA PACIFIC MICROSYSTEMS INC·Filed 2016·Granted Jun 13, 2017·0 cites·20 claims
- 0746US6949396B2Corner compensation method for fabricating MEMS and structure thereofWALSIN LIHWA CORP·Filed 2002·Granted Sep 27, 2005·2 cites·10 claims
- 0845US2007207063A1Device for controlling fluid sequenceINSTR TECHNOLOGY RES CT NAT AP·Filed 2007·Application pending·0 cites
- 0943US2007286739A1Apparatus for driving microfluid and driving method thereofINSTR TECHNOLOGY RES CT·Filed 2007·Application pending·0 cites
- 1039US2013205899A1Combo Transducer and Combo Transducer PackageASIA PACIFIC MICROSYSTEMS INC·Filed 2013·Application pending·0 cites
- 1135US7317575B2Tunable dispersive optical systemINSTR TECHNOLOGY RES CT·Filed 2005·Granted Jan 8, 2008·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →