Inventor · disambiguated record
Jen-Dong Hwang
Also filed as: HWANG JEN-DONG
4 granted patents·2 pending applications·67 citations·filing 1999–2008
74Inventor score
Top patents by PatentIndex Score
6 records- 0177US8373991B2Metal thermal interface material and thermal module and packaged microelectronic component containing the materialIND TECH RES INST·Filed 2008·Granted Feb 12, 2013·7 cites·20 claims
- 0274US6179046B1Heat dissipation deviceIND TECH RES INST·Filed 1999·Granted Jan 30, 2001·57 cites·18 claims
- 0360US7576428B2Melting temperature adjustable metal thermal interface materials and application thereofIND TECH RES INST·Filed 2007·Granted Aug 18, 2009·2 cites·22 claims
- 0452US8197714B2Electrically conductive compositeYEN MIN-YU·Filed 2006·Granted Jun 12, 2012·1 cites·18 claims
- 0538US2001043880A1Aluminum die casting alloyFiled 2001·Application pending·0 cites
- 0633US2007053166A1Heat dissipation device and composite material with high thermal conductivityIND TECH RES INST·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →