Inventor · disambiguated record
Jen-Huang Jeng
Also filed as: JENG JEN-HUANG
4 granted patents·148 citations·filing 1991–1997
80Inventor score
Files withIND TECH RES INST4
Top patents by PatentIndex Score
4 records- 0180US5877556AStructure for composite bumpsIND TECH RES INST·Filed 1997·Granted Mar 2, 1999·91 cites·4 claims
- 0261US5412997ANondestructive testing apparatus and methodIND TECH RES INST·Filed 1992·Granted May 9, 1995·24 cites·13 claims
- 0347US6024274AMethod for tape automated bonding to composite bumpsIND TECH RES INST·Filed 1996·Granted Feb 15, 2000·15 cites·11 claims
- 0446US5127573ATape automated bonding apparatus with automatic leveling stageIND TECH RES INST·Filed 1991·Granted Jul 7, 1992·18 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →