Inventor · disambiguated record
Jeonggi Jin
Also filed as: JIN JEONGGI
29 granted patents·16 pending applications·41 citations·filing 2011–2025
94Inventor score
Top patents by PatentIndex Score
45 records- 0197US11676887B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 13, 2023·8 cites·20 claims
- 0293US11996358B2Semiconductor packages having first and second redistribution patternsSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 28, 2024·2 cites·18 claims
- 0391US9799619B2Electronic device having a redistribution areaSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Oct 24, 2017·9 cites·20 claims
- 0489US11476176B2Semiconductor device having via protective layerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 18, 2022·2 cites·19 claims
- 0588US8872306B2Electrical interconnection structures including stress buffer layersSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Oct 28, 2014·9 cites·16 claims
- 0683US2025336798A1Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0781US12368093B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Jul 22, 2025·0 cites·20 claims
- 0881US11798872B2Interconnection structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 24, 2023·1 cites·20 claims
- 0981US11538783B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 27, 2022·1 cites·20 claims
- 1081US11302660B2Semiconductor devices and semiconductor packages including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 12, 2022·1 cites·19 claims
- 1179US12354987B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Jul 8, 2025·0 cites·20 claims
- 1278US12040294B2Semiconductor devices and semiconductor packages including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 16, 2024·0 cites·20 claims
- 1378US9847276B2Semiconductor devices having through-electrodes and methods for fabricating the sameKANG PIL-KYU·Filed 2014·Granted Dec 19, 2017·5 cites·14 claims
- 1476US2025343111A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1575US2025105116A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1674US12218039B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Feb 4, 2025·0 cites·15 claims
- 1774US11694978B2Semiconductor devices and semiconductor packages including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 4, 2023·0 cites·20 claims
- 1873US11984420B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 14, 2024·0 cites·20 claims
- 1973US11978688B2Semiconductor device having via protective layerSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 7, 2024·0 cites·20 claims
- 2073US2025014958A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2172US2024321794A1Semiconductor chip having a through electrode and semiconductor package including the semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2271US12476180B2Interconnection structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 2371US2024312923A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2470US12347760B2Interconnection structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 1, 2025·0 cites·19 claims
- 2570US9570377B2Semiconductor devices having through electrodes capped with self-aligned protection layersJIN JEONGGI·Filed 2015·Granted Feb 14, 2017·3 cites·18 claims
- 2669US12431474B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 30, 2025·0 cites·20 claims
- 2768US12027482B2Semiconductor chip having a through electrode and semiconductor package including the semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 2, 2024·0 cites·19 claims
- 2865US12381130B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 5, 2025·0 cites·19 claims
- 2965US12183664B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 31, 2024·0 cites·17 claims
- 3064US11637058B2Interconnection structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 25, 2023·0 cites·19 claims
- 3164US2025329692A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3264US2025343190A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3363US12021034B2Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 25, 2024·0 cites·20 claims
- 3460US2024387463A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3559US2025125290A1Device for semiconductor package comprising connecting strucure and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3658US2025132202A1Semiconductor package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3758US2025118574A1Method of manufacturing semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3857US12142541B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 12, 2024·0 cites·20 claims
- 3955US2024429176A1Semiconductor package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4051US2024096851A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4148US11444014B2Semiconductor packages including an insulating layer including a recessed surface and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 13, 2022·0 cites·18 claims
- 4247US8816499B2Electrical interconnections of semiconductor devices and methods for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Aug 26, 2014·0 cites·12 claims
- 4345US10872869B2Semiconductor devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Dec 22, 2020·0 cites·18 claims
- 4440US2013075905A1Semiconductor Chips and Semiconductor Packages and Methods of Fabricating the SameCHOI JU-IL·Filed 2012·Application pending·0 cites
- 4533US2012139097A1Semiconductor package and method of manufacturing the sameJIN JEONGGI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →