Inventor · disambiguated record
Jen-Chieh Kao
Also filed as: KAO JEN-CHIEH
22 granted patents·12 pending applications·240 citations·filing 2003–2024
95Inventor score
Top patents by PatentIndex Score
34 records- 0193US11410899B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Aug 9, 2022·3 cites·20 claims
- 0292US10580713B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Mar 3, 2020·6 cites·21 claims
- 0390US6809852B2Microsystem package structureADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Oct 26, 2004·49 cites·14 claims
- 0487US6822324B2Wafer-level package with a cavity and fabricating method thereofADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Nov 23, 2004·48 cites·26 claims
- 0586US11037891B2Device packageADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jun 15, 2021·3 cites·17 claims
- 0685US6768207B2Multichip wafer-level package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jul 27, 2004·44 cites·11 claims
- 0783US2024429115A1Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 0883US2025038136A1Device packageADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 0981US10381300B2Semiconductor device package including filling mold viaADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Aug 13, 2019·4 cites·26 claims
- 1080US12119312B2Device packageADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Oct 15, 2024·0 cites·10 claims
- 1180US11462455B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Oct 4, 2022·4 cites·17 claims
- 1278US12087652B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Sep 10, 2024·0 cites·17 claims
- 1377US6838762B2Water-level package with bump ringADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jan 4, 2005·24 cites·16 claims
- 1476US6693364B2Optical integrated circuit element package and process for making the sameADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Feb 17, 2004·23 cites·14 claims
- 1575US7614888B2Flip chip package processADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Nov 10, 2009·7 cites·12 claims
- 1673US7002257B2Optical component package and packaging including an optical component horizontally attached to a substrateADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Feb 21, 2006·19 cites·20 claims
- 1772US11705412B2Device packageADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Jul 18, 2023·0 cites·12 claims
- 1872US2024145357A1Electronic assemblyADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 1968US11862544B2Electronic assemblyADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Jan 2, 2024·0 cites·18 claims
- 2055US7247267B2Mold and method of molding semiconductor devicesADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Jul 24, 2007·6 cites·17 claims
- 2155US2024249988A1Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 2254US10332849B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Jun 25, 2019·0 cites·20 claims
- 2352US10991656B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Apr 27, 2021·0 cites·25 claims
- 2451US2023026633A1Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Application pending·0 cites
- 2550US10074622B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Sep 11, 2018·0 cites·20 claims
- 2648US10950530B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Mar 16, 2021·0 cites·32 claims
- 2744US2010200974A1Semiconductor package structure using the sameWENG CHAO-FU·Filed 2009·Application pending·0 cites
- 2842US2020312733A1Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Application pending·0 cites
- 2941US2007004087A1Chip packaging processKAO JEN-CHIEH·Filed 2005·Application pending·0 cites
- 3040US2005285245A1Substrate strip for a transparent packageADVANCED SEMICONDUCTOR ENG·Filed 2005·Application pending·0 cites
- 3140US2007052078A1Matrix package substrate structure, chip package structure and molding process thereofKAO JEN-CHIEH·Filed 2005·Application pending·0 cites
- 3236US8059422B2Thermally enhanced package structureTONG HO-MING·Filed 2008·Granted Nov 15, 2011·0 cites·14 claims
- 3336US2003193018A1Optical integrated circuit element package and method for making the sameFiled 2003·Application pending·0 cites
- 3436US2003214618A1Liquid crystal display device with bump and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2003·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Jen-Chieh Kao files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →