Inventor · disambiguated record

Jeungdae Kim

Also filed as: KIM JEUNGDAE

2 granted patents·1 pending application·0 citations·filing 2019–2023

25Inventor score

Technology areasH10W

Files withSEMICONDUCTOR COMPONENTS IND LLC3

Top patents by PatentIndex Score

3 records

0169US12476397B2Transfer molded power modules and methods of manufactureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
0249US2024162110A1Semiconductor device package assemblies and methods of manufactureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Application pending·0 cites
0342US11521921B2Semiconductor device package assemblies and methods of manufactureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Dec 6, 2022·0 cites·19 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →