Inventor · disambiguated record
Jeongseok Kim
Also filed as: KIM JEONGSEOK
24 granted patents·14 pending applications·17 citations·filing 2008–2024
92Inventor score
Files withSAMSUNG ELECTRONICS CO LTD32SK TELECOM CO LTD3AGENCY DEFENSE DEV2KOREA ELECTRONICS TELECOMM1
Top patents by PatentIndex Score
38 records- 0195US11581284B2Semiconductor package with under-bump metal structureSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 14, 2023·4 cites·17 claims
- 0292US11569175B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 31, 2023·5 cites·20 claims
- 0390US12261105B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Mar 25, 2025·1 cites·20 claims
- 0486US11916002B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 27, 2024·1 cites·20 claims
- 0586US11562966B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 24, 2023·1 cites·20 claims
- 0685US12069352B2Vision sensor and operating method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Aug 20, 2024·1 cites·20 claims
- 0784US11569158B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 31, 2023·1 cites·20 claims
- 0881US12021020B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 25, 2024·1 cites·20 claims
- 0981US11700438B2Vision sensor and operating method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 11, 2023·1 cites·20 claims
- 1080US11902673B2Electronic device for compensating for time delay of dynamic vision sensorSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 13, 2024·1 cites·20 claims
- 1179US12183665B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Dec 31, 2024·0 cites·20 claims
- 1278US2025118646A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1377US2024347468A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1475US12046562B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 23, 2024·0 cites·20 claims
- 1574US12394708B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Aug 19, 2025·0 cites·20 claims
- 1674US2025062221A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1768US12040297B2Methods of manufacturing semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 16, 2024·0 cites·20 claims
- 1866US12119305B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 15, 2024·0 cites·20 claims
- 1961US12159826B2Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 3, 2024·0 cites·16 claims
- 2060US2024371274A1Urban air traffic management service apparatus and management processing method thereofSK TELECOM CO LTD·Filed 2024·Application pending·0 cites
- 2160US2024155252A1Electronic device for compensating for time delay of dynamic vision sensorSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2260US2025298395A1Apparatus and method for controlling gimbalAGENCY DEFENSE DEV·Filed 2024·Application pending·0 cites
- 2358US12278191B2Semiconductor packages having wiring patternsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 15, 2025·0 cites·19 claims
- 2458US2025157343A1Method and device for setting exclusive lock within route, and storage medium storing instructions to perform method for setting exclusive lock within routeSK TELECOM CO LTD·Filed 2023·Application pending·0 cites
- 2558US2025046769A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2656US11153517B2Dynamic vision sensor device including bufferSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 19, 2021·0 cites·20 claims
- 2756US2025342772A1Method and device for partitioning airway of uam into multiple sections on basis of information on travel regionSK TELECOM CO LTD·Filed 2023·Application pending·0 cites
- 2854US2025149518A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2953US2025079319A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3052US2025105192A1Semiconductor package and manufacturing method for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3152US2025105117A1Semiconductor packages and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3251US11721620B2Fan-out type semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 8, 2023·0 cites·19 claims
- 3350US12111206B2Vision sensor including a voltage generation circuit for outputting a test bias voltage to a transistor and operating method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 8, 2024·0 cites·17 claims
- 3450US11398420B2Semiconductor package having core member and redistribution substrateSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 26, 2022·0 cites·20 claims
- 3548US11388361B2Image sensor, imaging device including image sensor, and method of operating imaging deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 12, 2022·0 cites·15 claims
- 3644US2010026582A1Near-field radio frequency identification reader antennaKOREA ELECTRONICS TELECOMM·Filed 2008·Application pending·0 cites
- 3743US12499558B2Apparatus and method for monitoring moving target based on complementary gimbal control through displacement partitioningAGENCY DEFENSE DEV·Filed 2023·Granted Dec 16, 2025·0 cites·11 claims
- 3842US11728283B2Package substrate and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 15, 2023·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →