Inventor · disambiguated record
Jerrold L. King
Also filed as: KING JERROLD L · KING JERROLD LYNN
78 granted patents·9 pending applications·5,072 citations·filing 1990–2006
99Inventor score
Files withMICRON TECHNOLOGY INC78KING JERROLD L2MODEN WALTER L2ADVANCED MICRO DEVICES INC1JIANG TONGBI1
Top patents by PatentIndex Score
87 records- 0199US6258623B1Low profile multi-IC chip package connectorMICRON TECHNOLOGY INC·Filed 1999·Granted Jul 10, 2001·354 cites·7 claims
- 0299US6225689B1Low profile multi-IC chip package connectorMICRON TECHNOLOGY INC·Filed 2000·Granted May 1, 2001·295 cites·64 claims
- 0399US6198172B1Semiconductor chip packageMICRON TECHNOLOGY INC·Filed 1997·Granted Mar 6, 2001·203 cites·24 claims
- 0499US5677566ASemiconductor chip packageMICRON TECHNOLOGY INC·Filed 1995·Granted Oct 14, 1997·550 cites·18 claims
- 0598US5214845AMethod for producing high speed integrated circuitsMICRON TECHNOLOGY INC·Filed 1992·Granted Jun 1, 1993·407 cites·4 claims
- 0697US6429528B1Multichip semiconductor packageMICRON TECHNOLOGY INC·Filed 1998·Granted Aug 6, 2002·194 cites·19 claims
- 0797US6246108B1Integrated circuit package including lead frame with electrically isolated alignment featureMICRON TECHNOLOGY INC·Filed 1999·Granted Jun 12, 2001·273 cites·20 claims
- 0897US6048744AIntegrated circuit package alignment featureMICRON TECHNOLOGY INC·Filed 1997·Granted Apr 11, 2000·275 cites·6 claims
- 0997US5879965APlastic lead frames for semiconductor devices, packages including same, and methods of fabricationMICRON TECHNOLOGY INC·Filed 1997·Granted Mar 9, 1999·173 cites·24 claims
- 1096US6686655B2Low profile multi-IC chip package connectorMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 3, 2004·45 cites·60 claims
- 1196US6486546B2Low profile multi-IC chip package connectorMICRON TECHNOLOGY INC·Filed 2002·Granted Nov 26, 2002·47 cites·60 claims
- 1296US5286679AMethod for attaching a semiconductor die to a leadframe using a patterned adhesive layerMICRON TECHNOLOGY INC·Filed 1993·Granted Feb 15, 1994·331 cites·22 claims
- 1396US5140404ASemiconductor device manufactured by a method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tapeMICRON TECHNOLOGY INC·Filed 1991·Granted Aug 18, 1992·208 cites·15 claims
- 1494US6066514AAdhesion enhanced semiconductor die for mold compound packagingMICRON TECHNOLOGY INC·Filed 1997·Granted May 23, 2000·113 cites·18 claims
- 1593US6531339B2Redundancy mapping in a multichip semiconductor packageMICRON TECHNOLOGY INC·Filed 2001·Granted Mar 11, 2003·62 cites·26 claims
- 1693US5140405ASemiconductor assembly utilizing elastomeric single axis conductive interconnectMICRON TECHNOLOGY INC·Filed 1991·Granted Aug 18, 1992·181 cites·15 claims
- 1792US6656767B1Method of forming a stack of packaged memory diceMICRON TECHNOLOGY INC·Filed 2002·Granted Dec 2, 2003·41 cites·13 claims
- 1891US6323543B1Plastic lead frames for semiconductor devices, packages including same, and methods of fabricationMICRON TECHNOLOGY INC·Filed 2000·Granted Nov 27, 2001·34 cites·36 claims
- 1991US6153929ALow profile multi-IC package connectorMICRON TECHNOLOGY INC·Filed 1998·Granted Nov 28, 2000·46 cites·64 claims
- 2091US5177032AMethod for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tapeMICRON TECHNOLOGY INC·Filed 1990·Granted Jan 5, 1993·105 cites·16 claims
- 2189US7091061B2Method of forming a stack of packaged memory diceMICRON TECHNOLOGY INC·Filed 2005·Granted Aug 15, 2006·10 cites·13 claims
- 2289US5661901AMethod for mounting and electrically interconnecting semiconductor diceMICRON TECHNOLOGY INC·Filed 1995·Granted Sep 2, 1997·91 cites·24 claims
- 2388US6207474B1Method of forming a stack of packaged memory die and resulting apparatusMICRON TECHNOLOGY INC·Filed 1998·Granted Mar 27, 2001·56 cites·13 claims
- 2488US6091136APlastic lead frames for semiconductor devicesMICRON TECHNOLOGY INC·Filed 1998·Granted Jul 18, 2000·49 cites·34 claims
- 2588US5440241AMethod for testing, burning-in, and manufacturing wafer scale integrated circuits and a packaged wafer assembly produced therebyMICRON TECHNOLOGY INC·Filed 1992·Granted Aug 8, 1995·118 cites·5 claims
- 2687US6438045B1Redundancy mapping in a multichip semiconductor packageMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 20, 2002·35 cites·21 claims
- 2787US5616953ALead frame surface finish enhancementMICRON TECHNOLOGY INC·Filed 1994·Granted Apr 1, 1997·88 cites·24 claims
- 2886US6773955B2Low profile multi-IC chip package connectorMICRON TECHNOLOGY INC·Filed 2002·Granted Aug 10, 2004·19 cites·9 claims
- 2984US6294410B1Plastic lead frames for semiconductor devices, packages including same, and methods of fabricationMICRON TECHNOLOGY INC·Filed 2000·Granted Sep 25, 2001·19 cites·25 claims
- 3083US6475831B2Methods for a low profile multi-IC chip package connectorMICRON TECHNOLOGY INC·Filed 2001·Granted Nov 5, 2002·14 cites·9 claims
- 3181US6465275B2Method of forming a stack of packaged memory die and resulting apparatusMICRON TECHNOLOGY INC·Filed 2001·Granted Oct 15, 2002·16 cites·13 claims
- 3281US6410859B1Electrical assembly for semiconductor diceMICRON TECHNOLOGY INC·Filed 1997·Granted Jun 25, 2002·56 cites·12 claims
- 3381US5892660ASingle in line memory module adapterMICRON TECHNOLOGY INC·Filed 1996·Granted Apr 6, 1999·45 cites·38 claims
- 3480US6897553B2Apparatus for forming a stack of packaged memory diceMICRON TECHNOLOGY INC·Filed 2003·Granted May 24, 2005·16 cites·14 claims
- 3580US6362519B2Low profile multi-IC chip package connectorMICRON TECHNOLOGY INC·Filed 2001·Granted Mar 26, 2002·13 cites·64 claims
- 3679US6329221B1Method of forming a stack of packaged memory die and resulting apparatusMICRON TECHNOLOGY INC·Filed 2000·Granted Dec 11, 2001·15 cites·13 claims
- 3776US6836003B2Integrated circuit package alignment featureMICRON TECHNOLOGY INC·Filed 2001·Granted Dec 28, 2004·17 cites·8 claims
- 3874US6724073B2Plastic lead frames for semiconductor devices and packages including sameMICRON TECHNOLOGY INC·Filed 2001·Granted Apr 20, 2004·10 cites·22 claims
- 3974US6445063B1Method of forming a stack of packaged memory die and resulting apparatusMICRON TECHNOLOGY INC·Filed 1999·Granted Sep 3, 2002·24 cites·14 claims
- 4073US6008073AMethod of manufacturing a bus bar structure on lead frame of semiconductor device packageMICRON TECHNOLOGY INC·Filed 1998·Granted Dec 28, 1999·36 cites·14 claims
- 4172US6781848B2Single-piece molded module housingMICRON TECHNOLOGY INC·Filed 2003·Granted Aug 24, 2004·13 cites·3 claims
- 4272US5583372AAdhesion enhanced semiconductor die for mold compound packagingMICRON TECHNOLOGY INC·Filed 1994·Granted Dec 10, 1996·37 cites·11 claims
- 4371US6544820B2Plastic lead frames for semiconductor devices, packages including same, and methods of fabricationMICRON TECHNOLOGY INC·Filed 2001·Granted Apr 8, 2003·11 cites·7 claims
- 4471US6246615B1Redundancy mapping in a multichip semiconductor packageMICRON TECHNOLOGY INC·Filed 1998·Granted Jun 12, 2001·29 cites·20 claims
- 4571US6124151APlastic lead frames for semiconductor devices, packages including same, and methods of fabricationMICRON TECHNOLOGY INC·Filed 1998·Granted Sep 26, 2000·19 cites·25 claims
- 4670US6063650AReduced stress LOC assemblyMICRON TECHNOLOGY INC·Filed 1998·Granted May 16, 2000·26 cites·11 claims
- 4769US6316824B1Plastic leads frames for semiconductor devicesMICRON TECHNOLOGY INC·Filed 1999·Granted Nov 13, 2001·18 cites·12 claims
- 4868US6884654B2Method of forming a stack of packaged memory diceMICRON TECHNOLOGY INC·Filed 2003·Granted Apr 26, 2005·7 cites·13 claims
- 4968US6762485B2Plastic lead frames for semiconductor devicesMICRON TECHNOLOGY INC·Filed 2001·Granted Jul 13, 2004·7 cites·2 claims
- 5068US5872398AReduced stress LOC assembly including cantilevered leadsMICRON TECHNOLOGY INC·Filed 1996·Granted Feb 16, 1999·25 cites·17 claims
Showing the top 50 of 87 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Jerrold L. King files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →