Inventor · disambiguated record
Jen-I Kuo
Also filed as: KUO JEN-I
2 granted patents·3 pending applications·24 citations·filing 2001–2006
54Inventor score
Top patents by PatentIndex Score
5 records- 0167US7222419B2Method of fabricating a ceramic substrate with a thermal conductive plug of a multi-chip packageCHUNG SHAN INST OF SCIENCE·Filed 2001·Granted May 29, 2007·24 cites·23 claims
- 0236US2004108058A1Lamination process of packaging substrateFiled 2002·Application pending·0 cites
- 0334US7508282B2Coupling device with electro-magnetic compensationCHUNG SHAN INST OF SCIENCE·Filed 2006·Granted Mar 24, 2009·0 cites·19 claims
- 0425US2004045656A1Method of fabricating a ceramic substrate with a thermal conductive plug of a multi-chip packageFiled 2003·Application pending·0 cites
- 0520US2006032574A1Method for fabricating multi-layer ceramic substrateKUO JEN-I·Filed 2004·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Jen-I Kuo files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →