Inventor · disambiguated record
Jer-Shyong Lai
Also filed as: LAI JER-SHYONG
1 granted patent·1 pending application·8 citations·filing 2002–2003
30Inventor score
Technology areasH10P
Files withCHUNG SHAN INST OF SCIENCE2
Top patents by PatentIndex Score
2 records- 0149US6685543B2Compensating chemical mechanical wafer polishing apparatus and methodCHUNG SHAN INST OF SCIENCE·Filed 2002·Granted Feb 3, 2004·8 cites·10 claims
- 0228US2004259481A1Method of polishing semiconductor copper interconnect integrated with extremely low dielectric constant materialCHUNG SHAN INST OF SCIENCE·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →