Inventor · disambiguated record
Jen-Hsiung Lai
Also filed as: LAI JEN-HSIUNG
1 granted patent·3 pending applications·1 citations·filing 2016–2019
17Inventor score
Files withEVERLIGHT ELECTRONICS CO LTD4
Top patents by PatentIndex Score
4 records- 0155US9646957B2LED packaging structure having stacked arrangement of protection element and LED chipEVERLIGHT ELECTRONICS CO LTD·Filed 2016·Granted May 9, 2017·1 cites·20 claims
- 0240US2020135991A1Lighting device and lighting moduleEVERLIGHT ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 0337US2017207375A1LED Packaging Structure Having Stacked Arrangement Of Protection Element And LED ChipEVERLIGHT ELECTRONICS CO LTD·Filed 2017·Application pending·0 cites
- 0428US2016380162A1Light Emitting Device And Manufacturing Method ThereofEVERLIGHT ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Jen-Hsiung Lai files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →