Inventor · disambiguated record
Jeng-Yuan Lai
Also filed as: LAI JENG Y · LAI JENG-YUAN
12 granted patents·7 pending applications·747 citations·filing 1999–2008
93Inventor score
Top patents by PatentIndex Score
19 records- 0197US6369455B1Externally-embedded heat-dissipating device for ball grid array integrated circuit packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Apr 9, 2002·149 cites·14 claims
- 0297US6282094B1Ball-grid array integrated circuit package with an embedded type of heat-dissipation structure and method of manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Aug 28, 2001·182 cites·23 claims
- 0393US7364948B2Method for fabricating semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Granted Apr 29, 2008·25 cites·12 claims
- 0492US6246115B1Semiconductor package having a heat sink with an exposed surfaceSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 1999·Granted Jun 12, 2001·170 cites·14 claims
- 0589US6236568B1Heat-dissipating structure for integrated circuit packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 1999·Granted May 22, 2001·90 cites·25 claims
- 0688US6323066B2Heat-dissipating structure for integrated circuit packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Nov 27, 2001·46 cites·11 claims
- 0784US7199453B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Granted Apr 3, 2007·11 cites·11 claims
- 0876US6501164B1Multi-chip semiconductor package with heat dissipating structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Dec 31, 2002·35 cites·11 claims
- 0972US7019389B2Lead frame and semiconductor package with the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Mar 28, 2006·23 cites·20 claims
- 1067US8304665B2Package substrate having landless conductive tracesCHANG CHIANG-CHENG·Filed 2008·Granted Nov 6, 2012·3 cites·12 claims
- 1159US6650015B2Cavity-down ball grid array package with semiconductor chip solder ballSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Nov 18, 2003·12 cites·10 claims
- 1250US2009008801A1Semiconductor device and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
- 1348US8207620B2Flip-chip semiconductor package and chip carrier for preventing corner delaminationTZENG YUAN-LIN·Filed 2007·Granted Jun 26, 2012·1 cites·10 claims
- 1446US2008246142A1Heat dissipation unit and a semiconductor package that has the heat dissipation unitSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
- 1546US2008277786A1Semiconductor package substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
- 1645US2008303134A1Semiconductor package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
- 1744US2008061814A1Electronic Component Test SystemSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Application pending·0 cites
- 1843US2007262444A1Semiconductor device and chip structure thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Application pending·0 cites
- 1942US2006279319A1Electronic component test systemSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →