Inventor · disambiguated record
Jeremy Lansford
Also filed as: LANSFORD JEREMY · LANSFORD JEREMY S · LANSFORD JEREMY SAM
19 granted patents·672 citations·filing 1999–2004
96Inventor score
Files withADVANCED MICRO DEVICES INC19
Top patents by PatentIndex Score
19 records- 0196US6567718B1Method and apparatus for monitoring consumable performanceADVANCED MICRO DEVICES INC·Filed 2000·Granted May 20, 2003·85 cites·38 claims
- 0293US6689258B1Electrochemically generated reactants for chemical mechanical planarizationADVANCED MICRO DEVICES INC·Filed 2002·Granted Feb 10, 2004·90 cites·20 claims
- 0390US6722942B1Chemical mechanical polishing with electrochemical controlADVANCED MICRO DEVICES INC·Filed 2001·Granted Apr 20, 2004·68 cites·31 claims
- 0488US6746616B1Method and apparatus for providing etch uniformity using zoned temperature controlADVANCED MICRO DEVICES INC·Filed 2001·Granted Jun 8, 2004·43 cites·34 claims
- 0586US6350179B2Method for determining a polishing recipe based upon the measured pre-polish thickness of a process layerADVANCED MICRO DEVICES INC·Filed 2000·Granted Feb 26, 2002·31 cites·8 claims
- 0684US6217412B1Method for characterizing polish pad lots to eliminate or reduce tool requalification after changing a polishing padADVANCED MICRO DEVICES INC·Filed 1999·Granted Apr 17, 2001·71 cites·22 claims
- 0782US6276989B1Method and apparatus for controlling within-wafer uniformity in chemical mechanical polishingADVANCED MICRO DEVICES INC·Filed 1999·Granted Aug 21, 2001·56 cites·28 claims
- 0881US6511898B1Method for controlling deposition parameters based on polysilicon grain size feedbackADVANCED MICRO DEVICES INC·Filed 2000·Granted Jan 28, 2003·25 cites·10 claims
- 0980US6352870B1Method of endpointing plasma strip process by measuring wafer temperatureADVANCED MICRO DEVICES INC·Filed 2000·Granted Mar 5, 2002·23 cites·24 claims
- 1078US6362116B1Method for controlling photoresist baking processesADVANCED MICRO DEVICES INC·Filed 2000·Granted Mar 26, 2002·16 cites·8 claims
- 1178US6213848B1Method for determining a polishing recipe based upon the measured pre-polish thickness of a process layerADVANCED MICRO DEVICES INC·Filed 1999·Granted Apr 10, 2001·44 cites·47 claims
- 1277US6485990B1Feed-forward control of an etch processing toolADVANCED MICRO DEVICES INC·Filed 2000·Granted Nov 26, 2002·19 cites·34 claims
- 1374US6461878B1Feedback control of strip time to reduce post strip critical dimension variation in a transistor gate electrodeADVANCED MICRO DEVICES INC·Filed 2000·Granted Oct 8, 2002·17 cites·18 claims
- 1472US6157078AReduced variation in interconnect resistance using run-to-run control of chemical-mechanical polishing during semiconductor fabricationADVANCED MICRO DEVICES INC·Filed 1999·Granted Dec 5, 2000·42 cites·10 claims
- 1571US6335286B1Feedback control of polish buff time as a function of scratch countADVANCED MICRO DEVICES INC·Filed 2000·Granted Jan 1, 2002·14 cites·38 claims
- 1664US6285133B1Ion implanter with multi-level vacuumADVANCED MICRO DEVICES INC·Filed 2000·Granted Sep 4, 2001·6 cites·32 claims
- 1759US7456110B2Method and apparatus for controlling etch selectivityADVANCED MICRO DEVICES INC·Filed 2004·Granted Nov 25, 2008·8 cites·21 claims
- 1847US6291253B1Feedback control of deposition thickness based on polish planarizationADVANCED MICRO DEVICES INC·Filed 1999·Granted Sep 18, 2001·12 cites·18 claims
- 1945US6613594B1Surface plasmon resonance-based endpoint detection for chemical mechanical planarization (CMP)ADVANCED MICRO DEVICES INC·Filed 2001·Granted Sep 2, 2003·2 cites·38 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →