Inventor · disambiguated record
Jeonil Lee
Also filed as: LEE JEONIL
10 granted patents·22 pending applications·1 citations·filing 2019–2025
78Inventor score
Files withSAMSUNG ELECTRONICS CO LTD32
Top patents by PatentIndex Score
32 records- 0187US12183660B2Semiconductor device including through-silicon via and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 31, 2024·1 cites·20 claims
- 0285US2025089236A1Semiconductor device including buried contact and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0384US12178034B2Semiconductor device including buried contact and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 24, 2024·0 cites·13 claims
- 0474US2025062193A1Semiconductor device including through-silicon via and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0574US2025054916A1Thermal pad, semiconductor chip including the same and method of manufacturing the semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0674US2025125225A1Semiconductor Device Including Via Structure And Method For Manufacturing The SameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0773US11844207B2Semiconductor device including buried contact and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 12, 2023·0 cites·7 claims
- 0872US2025300042A1Semiconductor devices including a through-hole electrodeSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0967US12199015B2Semiconductor device including via structure and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 14, 2025·0 cites·5 claims
- 1065US12230587B2Semiconductor device with crack-preventing structureSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 18, 2025·0 cites·6 claims
- 1165US12159859B2Thermal pad, semiconductor chip including the same and method of manufacturing the semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 3, 2024·0 cites·9 claims
- 1264US12347747B2Semiconductor devices including a through-hole electrodeSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 1, 2025·0 cites·20 claims
- 1364US2025157948A1Semiconductor device with crack-preventing structureSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1459US11149346B2Method of directly growing carbon material on substrateSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 19, 2021·0 cites·23 claims
- 1559US2024324234A1Three-dimensional (3d) ferroelectric random access memory (feram) and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1659US2025261362A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1759US2025024687A13-DIMENSIONAL (3D) FERROELECTRIC RANDOM ACCESS MEMORY (FeRAM) AND METHOD OF MANUFACTURING THE SAMESAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1858US12490489B2Semiconductor devices having spacer structuresSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 2, 2025·0 cites·20 claims
- 1958US2024276713A1Semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2058US2024324237A1Three-dimensional semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2158US2024322048A1Intergrated circuit devicesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2257US2024099015A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2356US2025056811A1Memory device and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2455US2025120072A1Memory device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2554US2025149508A1Semiconductor devices and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2654US2025174522A1Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2753US12217958B2Method of pre-treating substrate and method of directly forming graphene using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 4, 2025·0 cites·31 claims
- 2852US2023138616A1Semiconductor device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2951US2025374550A1Integrated circuit devices having vertically extending gate lines with wrap-around channel layersSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 3050US2023232612A1Semiconductor DevicesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 3148US2023369214A1Semiconductor device including data storage layerSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3244US2025053322A1Processing-in-memory (pim) high bandwidth memory (hbm) devices including pim dynamic random access memory (dram) diesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →