Inventor · disambiguated record
Jeng-Chi Lin
Also filed as: LIN JENG-CHI
4 granted patents·16 pending applications·0 citations·filing 2019–2025
57Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD20
Top patents by PatentIndex Score
20 records- 0180US2025316505A1Bevel edge removal methods, tools, and systemsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0278US2025357100A1Processing tool and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0376US2025329591A1In-situ defect count detection in post chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0475US12362201B2Bevel edge removal methods, tools, and systemsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 15, 2025·0 cites·20 claims
- 0573US2024379421A1Slurry composition, semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0670US2025312891A1Chemical mechanical polishing system with conditioning ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0770US2025353140A1Polishing apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0870US2025367786A1Cmp method and system with nanobubble cleaningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0969US2025312889A1Chemical mechanical polishing system with polishing pad height measurement sensor systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1068US12347735B2In-situ defect count detection in post chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 1, 2025·0 cites·20 claims
- 1168US2023364734A1Novel CMP Pad Design and Method of Using the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1266US12131944B2Slurry composition, semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 29, 2024·0 cites·20 claims
- 1363US11664213B2Bevel edge removal methods, tools, and systemsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 30, 2023·0 cites·20 claims
- 1463US2025303329A1Filter with metal-organic framework for cmp processingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1559US2025372435A1System and method for cleaning a wafer surfaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1658US2025349562A1Apparatus and methods for chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1757US2025339932A1Conditioning pad with deposited diamond coatingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1856US2025353134A1Heat cleaning system and method for cmp pad by-product controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1955US2024420978A1Retaining ring for chemical-mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2053US2021053179A1Novel CMP Pad Design and Method of Using the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →