Inventor · disambiguated record
Jen-Hao Liu
Also filed as: LIU JEN-HAO
34 granted patents·7 pending applications·123 citations·filing 1999–2025
96Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD24COMPAL ELECTRONICS INC4WISTRON CORP3LIU CHENG-SHING2TYSON BIORESEARCH INC2
Top patents by PatentIndex Score
41 records- 0192US11174156B2Bonding process for forming semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 16, 2021·2 cites·20 claims
- 0290US9455759B2Protection device capable of rotatably supporting a portable electronic deviceWISTRON CORP·Filed 2015·Granted Sep 27, 2016·15 cites·12 claims
- 0388US12258265B2Bonding process for forming semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 25, 2025·0 cites·20 claims
- 0486US7216900B2Fastener module for portable computersCOMPAL ELECTRONICS INC·Filed 2005·Granted May 15, 2007·23 cites·12 claims
- 0584US11192775B2Rough layer for better anti-stiction depositionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 7, 2021·2 cites·20 claims
- 0684US7159279B2Pivotal hinge mechanism used for portable computerCOMPAL ELECTRONIC INC·Filed 2005·Granted Jan 9, 2007·19 cites·16 claims
- 0782US9884755B2Rough anti-stiction layer for MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 6, 2018·2 cites·20 claims
- 0879US10173886B2Rough anti-stiction layer for MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 8, 2019·1 cites·20 claims
- 0979US7234204B2Pivotal hinge mechanism for mobile computerCOMPAL ELECTRONICS INC·Filed 2004·Granted Jun 26, 2007·30 cites·20 claims
- 1079US2025187907A1Bonding process for forming semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1177US9725312B1Preconditioning to enhance hydrophilic fusion bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 8, 2017·3 cites·20 claims
- 1275US11772963B2Bonding process for forming semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 3, 2023·0 cites·20 claims
- 1374US10237769B2Joint user clustering and power allocation method and base station using the sameUNIV NAT TSING HUA·Filed 2017·Granted Mar 19, 2019·2 cites·12 claims
- 1470US10273141B2Rough layer for better anti-stiction depositionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 30, 2019·1 cites·20 claims
- 1569US8934231B2Hinge fixing structure for fixing a hinge and display device therewithLIU CHENG-SHING·Filed 2012·Granted Jan 13, 2015·4 cites·10 claims
- 1668US10626010B2Bonding process for forming semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 21, 2020·0 cites·20 claims
- 1767US11034578B2Multi-layer sealing film for high seal yieldTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 15, 2021·0 cites·20 claims
- 1865US10759654B2Rough anti-stiction layer for MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 1, 2020·0 cites·20 claims
- 1965US9481567B2MEMS structure, cap substrate and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 1, 2016·1 cites·19 claims
- 2065US8861197B2Portable electronic module with back cover changing functionTSAI SONG-NINE·Filed 2012·Granted Oct 14, 2014·4 cites·10 claims
- 2163US11192778B2MEMS package with roughend interfaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 7, 2021·0 cites·20 claims
- 2263US7170740B1Foldable support structureCOMPAL ELECTRONICS INC·Filed 2006·Granted Jan 30, 2007·4 cites·5 claims
- 2362US10676343B2Multi-layer sealing film for high seal yieldTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 9, 2020·0 cites·20 claims
- 2459US10322928B2Multi-layer sealing film for high seal yieldTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 18, 2019·0 cites·20 claims
- 2558US8579645B2Connector mechanism for connecting a board cardWANG KUO-JUNG·Filed 2012·Granted Nov 12, 2013·6 cites·8 claims
- 2656US2024404839A1Wire bonding using in-situ plasma treatment and apparatus for effecting the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2755US2025062274A1Bonding apparatus and method of manufacturing an integrated circuit package using the apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2855US2025054786A1Die bonding tool with movable component for improved die protrusion control and methods for using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2954US10710872B2MEMS package with roughend interfaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 14, 2020·0 cites·20 claims
- 3054US2025006690A1Post-plasma clean infrared image inspection for oxideless bonding and apparatus for effecting the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3150US8643151B2Passivation layer for semiconductor devicesLIU JEN-HAO·Filed 2011·Granted Feb 4, 2014·1 cites·20 claims
- 3248US10112826B2Method for forming micro-electro-mechanical system (MEMS) device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 30, 2018·0 cites·20 claims
- 3347US10624569B2Method of increasing reading barcode informationTYSON BIORESEARCH INC·Filed 2018·Granted Apr 21, 2020·0 cites·11 claims
- 3447US9230918B1Semiconductor package structure, alignment structure, and alignment methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 5, 2016·0 cites·20 claims
- 3546US9483088B2Method for assembling a touch control display apparatus and the touch control display apparatusWISTRON CORP·Filed 2014·Granted Nov 1, 2016·0 cites·17 claims
- 3644US11211354B2Systems and methods for semi-flexible eutectic bonder piece arranegmentsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 28, 2021·0 cites·20 claims
- 3743US2008190244A1Method of fabricating metal compound through smelting with vaporization purificationUNIV NAT CENTRAL·Filed 2007·Application pending·0 cites
- 3839US9559738B1Tablet device with pivot unit having twist springWISTRON CORP·Filed 2016·Granted Jan 31, 2017·0 cites·15 claims
- 3939US8891036B2Fixing structure for fixing a display panel and display device therewithLIU CHENG-SHING·Filed 2012·Granted Nov 18, 2014·0 cites·10 claims
- 4029US6175496B1Heat-dissipating deviceCOMPAL ELECTRONICS INC·Filed 1999·Granted Jan 16, 2001·3 cites·8 claims
- 4127US2017016845A1Test stripTYSON BIORESEARCH INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →