Inventor · disambiguated record
Jen-Wei Liu
Also filed as: LIU JEN-WEI
4 granted patents·3 pending applications·6 citations·filing 2010–2025
62Inventor score
Top patents by PatentIndex Score
7 records- 0177US8421506B2Output buffer with process and temperature compensationWANG CHUA-CHIN·Filed 2010·Granted Apr 16, 2013·6 cites·19 claims
- 0276US2025357323A1Interconnect structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0374US2024350289A1Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0472US12080594B2Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 3, 2024·0 cites·20 claims
- 0567US11430692B2Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 30, 2022·0 cites·20 claims
- 0650US2023092846A1Combination for the treatment of cancer and application thereofEVERFRONT BIOTECH INC·Filed 2021·Application pending·0 cites
- 0737US8193837B2Corner detectorWANG CHUA-CHIN·Filed 2010·Granted Jun 5, 2012·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →