Inventor · disambiguated record
Jen-Fu Liu
Also filed as: LIU JEN-FU
5 granted patents·1 pending application·10 citations·filing 2005–2024
72Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0197US11227837B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 18, 2022·5 cites·20 claims
- 0287US11942433B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 26, 2024·1 cites·20 claims
- 0374US12087597B2Semiconductor structure comprising various via structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 10, 2024·0 cites·20 claims
- 0474US2024363364A1Semiconductor structure comprising various via structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0567US11715646B2Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 1, 2023·0 cites·20 claims
- 0659US7214611B2Imprinting-damascene process for metal interconnectionUNIV TSINGHUA·Filed 2005·Granted May 8, 2007·4 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →