Inventor · disambiguated record
Jeesoo Mok
Also filed as: MOK JEESOO
7 granted patents·12 pending applications·9 citations·filing 2019–2025
75Inventor score
Top patents by PatentIndex Score
19 records- 0191US11810844B2Component carrier and method of manufacturing the sameAT&S CHONGQING COMPANY LTD·Filed 2021·Granted Nov 7, 2023·4 cites·19 claims
- 0277US11058009B2Component carrier comprising a photo-imageable dielectric and method of manufacturing the sameAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2019·Granted Jul 6, 2021·3 cites·27 claims
- 0374US11289452B2Component carrier and method of manufacturing the sameAT&S CHONGQING COMPANY LTD·Filed 2019·Granted Mar 29, 2022·2 cites·21 claims
- 0464US2023245971A1Module Comprising a Semiconductor-based Component and Method of Manufacturing the SameAT&S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2023·Application pending·0 cites
- 0559US12136580B2Embedding methods for fine-pitch components and corresponding component carriersAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2022·Granted Nov 5, 2024·0 cites·18 claims
- 0658US2025063668A1Embedding Methods for Fine-Pitch Components and Corresponding Component CarriersAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2024·Application pending·0 cites
- 0754US2024021440A1Component Carrier and Method of Manufacturing the SameAT&S CHONGQING COMPANY LTD·Filed 2023·Application pending·0 cites
- 0853US2025349556A1Package and Manufacturing MethodAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2023·Application pending·0 cites
- 0953US2025349697A1Package And Method of Manufacturing A PackageAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2023·Application pending·0 cites
- 1052US12205877B2Ultra-thin component carrier having high stiffness and method of manufacturing the sameAT&S CHONGQING COMPANY LTD·Filed 2022·Granted Jan 21, 2025·0 cites·23 claims
- 1152US2023245990A1Component Carrier With Embedded IC Substrate Inlay, and Manufacturing MethodAT&S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2023·Application pending·0 cites
- 1252US2023232535A1Component Carrier With Connected Component Having Redistribution Layer at Main SurfaceAT&S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2023·Application pending·0 cites
- 1349US2024334617A1Component Carrier Method of Manufacturing the Component Carrier and Component Carrier ArrangementAT&S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2024·Application pending·0 cites
- 1448US11424179B2Ultra-thin component carrier having high stiffness and method of manufacturing the sameAT&S CHONGQING COMPANY LTD·Filed 2020·Granted Aug 23, 2022·0 cites·10 claims
- 1548US2025081330A1Component Carrier with Rough Surface and Smooth Surface Metal Traces and Manufacturing MethodAT&S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2023·Application pending·0 cites
- 1646US12207399B2Component carrier having a double dielectric layer and method of manufacturing the sameAT&S CHONGQING COMPANY LTD·Filed 2020·Granted Jan 21, 2025·0 cites·28 claims
- 1745US2025336831A1Package with Component Carrier, Interposer and Component and Method of Manufacturing the SameAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2023·Application pending·0 cites
- 1843US2020163223A1Method of Manufacturing a Component Carrier Using a Separation Component, the Component Carrier, and a Semifinished ProductAT&S CHONGQING COMPANY LTD·Filed 2019·Application pending·0 cites
- 1941US2025301565A1Component Carrier and Manufacturing MethodAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2025·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Jeesoo Mok files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →