Inventor · disambiguated record
Jean-Michel Morelle
Also filed as: MORELLE JEAN-MICHEL
11 granted patents·5 pending applications·12 citations·filing 2002–2017
83Inventor score
Files withMORELLE JEAN-MICHEL5VALEO ELECTRONIQUE SYS LIAISON4VALEO ETUDES ELECTRONIQUES3MARTIN GERARD-MARIE1VALEO ELECTRONIQUE & SYSTEMES1
Top patents by PatentIndex Score
16 records- 0176US10082265B2Automotive vehicle lighting device with electrical connection circuit board connected to substrate by anisotropic conductive filmVALEO VISION·Filed 2017·Granted Sep 25, 2018·2 cites·8 claims
- 0264US8723079B2Laser soldering using thermal characteristicsMARTIN GERARD-MARIE·Filed 2007·Granted May 13, 2014·3 cites·13 claims
- 0362US8039973B2Electronic module having a multi-layer conductor for reducing its resistivity and a method of assembling such a moduleVALEO ETUDES ELECTRONIQUES·Filed 2007·Granted Oct 18, 2011·4 cites·12 claims
- 0456US8958209B2Electronic power module, and method for manufacturing said moduleMORELLE JEAN-MICHEL·Filed 2010·Granted Feb 17, 2015·2 cites·10 claims
- 0554US8822880B2Method and device for controlling the power transmitted by a laser to a reference point, soldering device and methodMORELLE JEAN-MICHEL·Filed 2006·Granted Sep 2, 2014·1 cites·24 claims
- 0649US2010089879A1Method of bonding a member to a support by addition of material, and device for arranging two elements, one on the otherVALEO ELECTRONIQUE SYS LIAISON·Filed 2007·Application pending·0 cites
- 0748US8952288B2Method of bonding a member to a support by addition of material, and device for arranging two elements, one on the otherVALEO ELECTRONIQUE SYS LIAISON·Filed 2012·Granted Feb 10, 2015·0 cites·11 claims
- 0847US9706665B2Device for assembling a chip on a substrate by providing a solder-forming massVALEO ETUDES ELECTRONIQUES·Filed 2014·Granted Jul 11, 2017·0 cites·7 claims
- 0942US9167703B2Method for assembling a chip on a substrateVIVET LAURENT·Filed 2009·Granted Oct 20, 2015·0 cites·5 claims
- 1040US8742259B2Holder for electrical component and electrical device including the holder and componentMORELLE JEAN-MICHEL·Filed 2007·Granted Jun 3, 2014·0 cites·8 claims
- 1139US8444913B2Method of assembling a member on a support by sintering a mass of conductive powderMORELLE JEAN-MICHEL·Filed 2008·Granted May 21, 2013·0 cites·11 claims
- 1238US8916963B2Power module for an automobileMORELLE JEAN-MICHEL·Filed 2010·Granted Dec 23, 2014·0 cites·17 claims
- 1338US2009175005A1Support, in Particular for an Electronic Power Component, a Power Module Including the Support, an Assembly Including the Module, and an Electrical Member Controlled by the ModuleVALEO ETUDES ELECTRONIQUES·Filed 2007·Application pending·0 cites
- 1435US2007147009A1Device for cooling an electrical component and production method thereofVALEO ELECTRONIQUE & SYSTEMES·Filed 2004·Application pending·0 cites
- 1532US2005161778A1Power module and power module assemblyVALEO ELECTRONIQUE SYS LIAISON·Filed 2002·Application pending·0 cites
- 1632US2007284341A1Method of Laser Welding Without Filler Material, and an Electrical Device Suitable for Being Made by the MethodVALEO ELECTRONIQUE SYS LIAISON·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →