Inventor · disambiguated record
Jeongjoon Oh
Also filed as: OH JEONGJOON
3 granted patents·4 citations·filing 2020–2021
54Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD3
Top patents by PatentIndex Score
3 records- 0192US11862603B2Semiconductor packages with chips partially embedded in adhesiveSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 2, 2024·4 cites·18 claims
- 0254US11670556B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 6, 2023·0 cites·20 claims
- 0350US11158550B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 26, 2021·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →