Inventor · disambiguated record
Jeng-Yang Pan
Also filed as: PAN JENG-YANG
5 granted patents·1 pending application·20 citations·filing 2001–2014
74Inventor score
Top patents by PatentIndex Score
6 records- 0165US6881675B2Method and system for reducing wafer edge tungsten residue utilizing a spin etchTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Apr 19, 2005·11 cites·16 claims
- 0264US9647090B2Surface passivation for germanium-based semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 9, 2017·1 cites·19 claims
- 0353US6530103B2Method and apparatus for eliminating wafer breakage during wafer transfer by a vacuum padTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Mar 11, 2003·3 cites·8 claims
- 0447US6875705B2Method of high selectivity wet etching of salicidesTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Apr 5, 2005·4 cites·20 claims
- 0540US6794615B2Semiconductor wafer tray positioningTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Sep 21, 2004·1 cites·9 claims
- 0639US2006205217A1Method and system for reducing wafer edge tungsten residue utilizing a spin etchTAIWAN SEMICONDUCTOR MFG·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →