Inventor · disambiguated record
Je-Hun Park
Also filed as: PARK JE HUN
9 granted patents·6 pending applications·4 citations·filing 2013–2023
76Inventor score
Files withKORLOY INC15
Top patents by PatentIndex Score
15 records- 0178US9394601B2Hard film for cutting toolKORLOY INC·Filed 2013·Granted Jul 19, 2016·2 cites·5 claims
- 0270US11141801B2Cutting tool having partially-removed film formed thereonKORLOY INC·Filed 2020·Granted Oct 12, 2021·0 cites·5 claims
- 0365US2015307998A1Multilayer thin film for cutting tool and cutting tool including the sameKORLOY INC·Filed 2013·Application pending·0 cites
- 0464US2024216999A1Hard coating for cutting tools with excellent wear resistanceKORLOY INC·Filed 2023·Application pending·0 cites
- 0563US9855608B2Hard coating film for cutting toolsKORLOY INC·Filed 2014·Granted Jan 2, 2018·2 cites·4 claims
- 0663US2015337459A1Multilayer thin film for cutting tool and cutting tool including the sameKORLOY INC·Filed 2013·Application pending·0 cites
- 0761US11376675B2Cutting tool having partially-removed film formed thereonKORLOY INC·Filed 2020·Granted Jul 5, 2022·0 cites·5 claims
- 0860US12195837B2Cutting tool with hard coating film formed thereonKORLOY INC·Filed 2020·Granted Jan 14, 2025·0 cites·6 claims
- 0959US9273388B2Hard film for cutting toolKORLOY INC·Filed 2013·Granted Mar 1, 2016·0 cites·10 claims
- 1059US2025108439A1Hard film-coated cutting toolKORLOY INC·Filed 2022·Application pending·0 cites
- 1152US11359272B2Hard film having excellent wear resistance and toughnessKORLOY INC·Filed 2018·Granted Jun 14, 2022·0 cites·4 claims
- 1252US2016325363A1Cutting tool having partially-removed film formed thereonKORLOY INC·Filed 2015·Application pending·0 cites
- 1349US2021404052A1Hard coating for cutting toolKORLOY INC·Filed 2019·Application pending·0 cites
- 1448US10738376B2Hard coating for cutting toolKORLOY INC·Filed 2016·Granted Aug 11, 2020·0 cites·3 claims
- 1546US9422627B2Hard film for cutting toolKORLOY INC·Filed 2013·Granted Aug 23, 2016·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →