Inventor · disambiguated record
Jeevak M. Parpia
Also filed as: PARPIA JEEVAK M
11 granted patents·2 pending applications·67 citations·filing 2002–2012
88Inventor score
Files withCORNELL RES FOUNDATION INC5PARPIA JEEVAK M3ZALALUTDINOV MAXIM3AUBIN KEITH L1CRAIGHEAD HAROLD G1
Top patents by PatentIndex Score
13 records- 0186US8174352B2Method for making a transducer, transducer made therefrom, and applications thereofPARPIA JEEVAK M·Filed 2009·Granted May 8, 2012·18 cites·37 claims
- 0286US7812502B2Shell type actuatorCORNELL RES FOUNDATION INC·Filed 2006·Granted Oct 12, 2010·13 cites·31 claims
- 0385US7358822B2MEMS oscillator driveCORNELL RES FOUNDATION INC·Filed 2006·Granted Apr 15, 2008·17 cites·20 claims
- 0484US7843283B2MEMS controlled oscillatorCORNELL RES FOUNDATION INC·Filed 2006·Granted Nov 30, 2010·13 cites·25 claims
- 0556US8049580B2MEMS controlled oscillatorCORNELL RES FOUNDATION INC·Filed 2010·Granted Nov 1, 2011·1 cites·19 claims
- 0654US8704315B2CMOS integrated micromechanical resonators and methods for fabricating the samePARPIA JEEVAK M·Filed 2009·Granted Apr 22, 2014·1 cites·30 claims
- 0747US7654140B2Heat pumped parametric MEMS deviceCORNELL RES FOUNDATION INC·Filed 2002·Granted Feb 2, 2010·4 cites·14 claims
- 0843US8330323B2Thermal-mechanical signal processingZALALUTDINOV MAXIM·Filed 2011·Granted Dec 11, 2012·0 cites·19 claims
- 0941US9562888B2Stress-based sensor, method, and applicationsPARPIA JEEVAK M·Filed 2011·Granted Feb 7, 2017·0 cites·10 claims
- 1041US2013062104A1Resonant material layer apparatus, method and applicationsCRAIGHEAD HAROLD G·Filed 2012·Application pending·0 cites
- 1138US9007213B2Methods and systems for object identification and for authenticationAUBIN KEITH L·Filed 2007·Granted Apr 14, 2015·0 cites·15 claims
- 1238US8072117B2Thermal-mechanical signal processingZALALUTDINOV MAXIM·Filed 2006·Granted Dec 6, 2011·0 cites·18 claims
- 1338US2006210102A1Local telemetry device and methodZALALUTDINOV MAXIM·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →