Inventor · disambiguated record
Jeffrey M. Peterson
Also filed as: PETERSON JEFFREY M
10 granted patents·2 pending applications·91 citations·filing 1991–2023
87Inventor score
Top patents by PatentIndex Score
12 records- 0183US12098981B2Robotic soil sampling assemblyPETERSON JEFFREY M·Filed 2022·Granted Sep 24, 2024·1 cites·15 claims
- 0269USD779099SLuminaireCREE INC·Filed 2015·Granted Feb 14, 2017·13 cites·1 claims
- 0366US7723815B1Wafer bonded composite structure for thermally matching a readout circuit (ROIC) and an infrared detector chip both during and after hybridizationRAYTHEON CO·Filed 2004·Granted May 25, 2010·14 cites·12 claims
- 0460US11817521B2Electrical contact fabricationRAYTHEON CO·Filed 2021·Granted Nov 14, 2023·0 cites·20 claims
- 0560US5755454ATowing system for a vehicleEDWARDS JERRY A·Filed 1996·Granted May 26, 1998·28 cites·10 claims
- 0660US5579163AMethod and apparatus for producing spectral displaysFiled 1994·Granted Nov 26, 1996·24 cites·24 claims
- 0758US2024170600A1HgZnTe DETECTOR ON SILICON SUBSTRATERAYTHEON CO·Filed 2023·Application pending·0 cites
- 0855US9443923B2Substrate for molecular beam epitaxy (MBE) HgCdTe growthRAYTHEON CO·Filed 2014·Granted Sep 13, 2016·0 cites·15 claims
- 0953US7863097B2Method of preparing detectors for oxide bonding to readout integrated chipsRAYTHEON CO·Filed 2008·Granted Jan 4, 2011·1 cites·26 claims
- 1046US2016293711A1Substrate For Molecular Beam Epitaxy (MBE) HGCDTE GrowthRAYTHEON CO·Filed 2016·Application pending·0 cites
- 1135US6884645B2Method for preparing a device structure having a wafer structure deposited on a composite substrate having a matched coefficient of thermal expansionRAYTHEON CO·Filed 2003·Granted Apr 26, 2005·0 cites·24 claims
- 1234US5192063AClamp armAPPLIED POWER INC·Filed 1991·Granted Mar 9, 1993·10 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →