Inventor · disambiguated record
Jean-Louis Pornin
Also filed as: PORNIN JEAN-LOUIS
19 granted patents·2 pending applications·97 citations·filing 1990–2018
92Inventor score
Files withCOMMISSARIAT ENERGIE ATOMIQUE14PORNIN JEAN-LOUIS3CAPLET STEPHANE1COMMISSARIAT L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES1EPCOS AG1
Top patents by PatentIndex Score
21 records- 0181US10629361B2Inductance device and method of manufacturing the sameCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2016·Granted Apr 21, 2020·2 cites·15 claims
- 0277US8338282B2Method for encapsulating a microcomponent using a mechanically reinforced capPORNIN JEAN-LOUIS·Filed 2011·Granted Dec 25, 2012·4 cites·10 claims
- 0376US8962069B2Process for making a structure with hermetically closed cavity under controlled atmospherePORNIN JEAN-LOUIS·Filed 2012·Granted Feb 24, 2015·5 cites·15 claims
- 0476US7786561B2Encapsulated microcomponent equipped with at least one getterCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2007·Granted Aug 31, 2010·6 cites·7 claims
- 0575US6566170B1Method for forming a device having a cavity with controlled atmosphereCOMMISSARIAT ENERGIE ATOMIQUE·Filed 1999·Granted May 20, 2003·49 cites·9 claims
- 0672US9908773B2Method for packaging a microelectronic device in a hermetically sealed cavity and managing the atmosphere of the cavity with a dedicated holeCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2013·Granted Mar 6, 2018·3 cites·14 claims
- 0769US8183474B2Microcomponent provided with a cavity delimited by a cap with enhanced mechanical resistanceGILLOT CHARLOTTE·Filed 2007·Granted May 22, 2012·6 cites·20 claims
- 0866US8999762B2Process for encapsulating a micro-device by attaching a cap and depositing getter through the capCOMMISSARIAT L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES·Filed 2012·Granted Apr 7, 2015·2 cites·16 claims
- 0961US8884331B2Structure for hermetic encapsulation of a device and an electronic componentCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2012·Granted Nov 11, 2014·1 cites·16 claims
- 1060US9309110B2Method of encapsulating a microelectronic device by a getter materialCAPLET STEPHANE·Filed 2009·Granted Apr 12, 2016·1 cites·26 claims
- 1151US10809621B2Process for the exposure of a region on one face of an electronic deviceCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2018·Granted Oct 20, 2020·0 cites·19 claims
- 1245US8680664B2Structure for encapsulating an electronic deviceCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2012·Granted Mar 25, 2014·0 cites·9 claims
- 1344US9199839B2Method of hermetically sealing a hole with a fuse materialCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2014·Granted Dec 1, 2015·0 cites·19 claims
- 1441US10532924B2Packaging structure of a microelectronic device having a hermeticity improved by a diffusion barrier layerCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2013·Granted Jan 14, 2020·0 cites·9 claims
- 1541US2013207281A1Microelectronic substrate comprising a layer of buried organic materialCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2013·Application pending·0 cites
- 1641US2017144883A1Microelectronic package and method of manufacturing a microelectronic packageEPCOS AG·Filed 2014·Application pending·0 cites
- 1740US9896331B2Method for encapsulating a microelectronic device with a release hole of variable dimensionCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2016·Granted Feb 20, 2018·0 cites·16 claims
- 1838US5131584AMethod to interconnect electric components by means of solder elementsCOMMISSARIAT ENERGIE ATOMIQUE·Filed 1990·Granted Jul 21, 1992·11 cites·5 claims
- 1934US8772883B2Sealed cavity and method for producing such a sealed cavityPORNIN JEAN-LOUIS·Filed 2010·Granted Jul 8, 2014·0 cites·19 claims
- 2030US5968389AMethod and machine for hybridization by refusionCOMMISSARIAT ENERGIE ATOMIQUE·Filed 1997·Granted Oct 19, 1999·6 cites·58 claims
- 2128US5794331AProcess for the exchange of a detection module hybridized by welding bumpsCOMMISSARIAT ENERGIE ATOMIQUE·Filed 1995·Granted Aug 18, 1998·1 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →