Inventor · disambiguated record
Jeffrey Salvacion Solas
Also filed as: SOLAS JEFFREY · SOLAS JEFFREY S · SOLAS JEFFREY SALVACION
3 granted patents·15 pending applications·0 citations·filing 2021–2024
46Inventor score
Files withTEXAS INSTRUMENTS INC18
Top patents by PatentIndex Score
18 records- 0164US2025020610A1Sensor having tubular walled sensing cavityTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0264US2024234282A1Semiconductor chip packages having bond over active circuit (boac) structuresTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0363US12135303B2Sensor having tubular walled sensing cavityTEXAS INSTRUMENTS INC·Filed 2023·Granted Nov 5, 2024·0 cites·22 claims
- 0459US11942407B2Semiconductor chip packages having bond over active circuit (BOAC) structuresTEXAS INSTRUMENTS INC·Filed 2021·Granted Mar 26, 2024·0 cites·12 claims
- 0556US12482769B2Selective plating for packaged semiconductor devicesTEXAS INSTRUMENTS INC·Filed 2022·Granted Nov 25, 2025·0 cites·20 claims
- 0651US2025391800A1Electronic device and solder reflow-less processTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0751US2025246563A1Partially pulse-plated bond padsTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0851US2025273547A1Stitch bond to copper nanotwin plated leadTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0950US2025140735A1Direct copper wire bonding on nanotwin copper structuresTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 1049US2025201748A1Low profile die terminal with ball drop solderTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 1148US2024404973A1Wafer level process for semiconductor device packageTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 1247US2025042723A1Protective coating for copper surface in sensorTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 1347US2025201738A1Die with bond padTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 1447US2025069976A1Cavity integrated circuitTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 1547US2025006573A1Open cavity sensorTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 1646US2024363466A1Semiconductor device package with open sensor cavityTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 1745US2025140745A1Die with connection padTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 1844US2025140718A1Dielectric-filled bond pads in clip packagesTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →