Inventor · disambiguated record
Jean-Charles Souriau
Also filed as: SOURIAU JEAN-CHARLES
18 granted patents·3 pending applications·51 citations·filing 1997–2024
91Inventor score
Files withCOMMISSARIAT ENERGIE ATOMIQUE11SOURIAU JEAN-CHARLES5COMMISSARIAT A L’ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES2BALERAS FRANCOIS1COMMISSARIAT A IENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES1
Top patents by PatentIndex Score
21 records- 0187US8928141B2Method for fabricating two substrates connected by at least one mechanical and electrically conductive connection and structure obtainedSOURIAU JEAN-CHARLES·Filed 2012·Granted Jan 6, 2015·11 cites·7 claims
- 0268US11812559B2Flexible electronic structure and method for producing sameCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2019·Granted Nov 7, 2023·1 cites·21 claims
- 0367US7031578B2Method and device for passive alignment of optical waveguides and optoelectronic components and optical system using said deviceCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2001·Granted Apr 18, 2006·11 cites·12 claims
- 0466US7729033B2Production of cavities filled with a fluid material in an optical microtechnological compoundCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2008·Granted Jun 1, 2010·2 cites·28 claims
- 0564US8039285B2Thin film getter protectionCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2006·Granted Oct 18, 2011·3 cites·20 claims
- 0663US7026239B2Method for making an anisotropic conductive polymer film on a semiconductor waferCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2003·Granted Apr 11, 2006·11 cites·6 claims
- 0760US8853845B2Component with encapsulated active element and implantable medical advice incorporating such a componentCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2013·Granted Oct 7, 2014·1 cites·11 claims
- 0858US8039306B23D integration of vertical components in reconstituted substratesCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2008·Granted Oct 18, 2011·2 cites·26 claims
- 0958US2025024600A1Interconnexion film and electronic structure comprising such a filmCOMMISSARIAT A L’ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES·Filed 2024·Application pending·0 cites
- 1051US7349603B2Optical arrangement with two optical inputs/outputs and production methodsCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2003·Granted Mar 25, 2008·3 cites·11 claims
- 1151US2025087610A1Electronic chip with connecting pillars for sintering assemblyCOMMISSARIAT A IENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES·Filed 2024·Application pending·0 cites
- 1249US2025336868A1Electronic structure including an interconnection filmCOMMISSARIAT A L’ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES·Filed 2022·Application pending·0 cites
- 1345US8466568B2Multi-component device integrated into a matrixSOURIAU JEAN-CHARLES·Filed 2009·Granted Jun 18, 2013·0 cites·13 claims
- 1444US11179727B2Method for integrating structures in a support and associated deviceCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2019·Granted Nov 23, 2021·0 cites·17 claims
- 1544US8288841B2Handle wafer having viewing windowsSOURIAU JEAN-CHARLES·Filed 2010·Granted Oct 16, 2012·0 cites·9 claims
- 1642US8409971B2Integrated multicomponent device in a semiconducting dieSOURIAU JEAN-CHARLES·Filed 2008·Granted Apr 2, 2013·0 cites·18 claims
- 1742US8246184B2Production of cavities that can be filled with a fluid material in an optical microtechnological componentSOURIAU JEAN-CHARLES·Filed 2007·Granted Aug 21, 2012·0 cites·8 claims
- 1842US6077141AProcess for manufacturing a vacuum field emitter device containing hydrogen and apparatuses for using this processCOMMISSARIAT ENERGIE ATOMIQUE·Filed 1997·Granted Jun 20, 2000·6 cites·12 claims
- 1939US10173890B2Microelectronic device housing bearing on the microelectronic deviceCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2017·Granted Jan 8, 2019·0 cites·20 claims
- 2038US9768518B2Microelectronic wireless transmission deviceCOMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE ALT·Filed 2013·Granted Sep 19, 2017·0 cites·18 claims
- 2138US8159076B2Method of producing a via in a reconstituted substrateBALERAS FRANCOIS·Filed 2008·Granted Apr 17, 2012·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →