Inventor · disambiguated record
Jeremy K. Stephens
Also filed as: STEPHENS JEREMY · STEPHENS JEREMY K · STEPHENS JEREMY KASPAR
23 granted patents·669 citations·filing 1998–2008
96Inventor score
Top patents by PatentIndex Score
23 records- 0198US6420216B1Fuse processing using dielectric planarization pillarsIBM·Filed 2000·Granted Jul 16, 2002·331 cites·16 claims
- 0284US6449202B1DRAM direct sensing schemeIBM·Filed 2001·Granted Sep 10, 2002·37 cites·17 claims
- 0382US6348395B1Diamond as a polish-stop layer for chemical-mechanical planarization in a damascene process flowIBM·Filed 2000·Granted Feb 19, 2002·25 cites·29 claims
- 0482US5915183ARaised source/drain using recess etch of polysiliconIBM·Filed 1998·Granted Jun 22, 1999·69 cites·14 claims
- 0577US7733964B2Automatic adaptive equalization method for high-speed serial transmission linkIBM·Filed 2007·Granted Jun 8, 2010·6 cites·5 claims
- 0677US7295618B2Automatic adaptive equalization method and system for high-speed serial transmission linkIBM·Filed 2004·Granted Nov 13, 2007·21 cites·10 claims
- 0767US6552944B2Single bitline direct sensing architecture for high speed memory deviceIBM·Filed 2001·Granted Apr 22, 2003·16 cites·72 claims
- 0866US7466156B2System of digitally testing an analog driver circuitIBM·Filed 2004·Granted Dec 16, 2008·11 cites·13 claims
- 0965US6711078B2Writeback and refresh circuitry for direct sensed DRAM macroIBM·Filed 2002·Granted Mar 23, 2004·14 cites·20 claims
- 1064US7352815B2Data transceiver and method for equalizing the data eye of a differential input data signalIBM·Filed 2003·Granted Apr 1, 2008·10 cites·8 claims
- 1163US6696759B2Semiconductor device with diamond-like carbon layer as a polish-stop layerIBM·Filed 2001·Granted Feb 24, 2004·7 cites·1 claims
- 1262US6379222B2Methods and apparatus for chemical mechanical planarization (CMP) of a semiconductor waferSIEMENS AG·Filed 1999·Granted Apr 30, 2002·23 cites·6 claims
- 1357US6261914B1Process for improving local uniformity of chemical mechanical polishing using a self-aligned polish rate enhancement layerIBM·Filed 1999·Granted Jul 17, 2001·21 cites·20 claims
- 1455US5972787ACMP process using indicator areas to determine endpointIBM·Filed 1998·Granted Oct 26, 1999·20 cites·7 claims
- 1553US6020262AMethods and apparatus for chemical mechanical planarization (CMP) of a semiconductor waferSIEMENS AG·Filed 1998·Granted Feb 1, 2000·16 cites·11 claims
- 1652US6890815B2Reduced cap layer erosion for borderless contactsIBM·Filed 2003·Granted May 10, 2005·5 cites·25 claims
- 1751US6102776AApparatus and method for controlling polishing of integrated circuit substratesIBM·Filed 1999·Granted Aug 15, 2000·15 cites·17 claims
- 1847US6614714B2Semiconductor memory system having a data clock system for reliable high-speed data transfersIBM·Filed 2002·Granted Sep 2, 2003·5 cites·18 claims
- 1945US7659740B2System and method of digitally testing an analog driver circuitIBM·Filed 2008·Granted Feb 9, 2010·0 cites·4 claims
- 2041US6129610APolish pressure modulation in CMP to preferentially polish raised featuresIBM·Filed 1998·Granted Oct 10, 2000·9 cites·8 claims
- 2139US6778447B2Embedded DRAM system having wide data bandwidth and data transfer data protocolIBM·Filed 2002·Granted Aug 17, 2004·2 cites·28 claims
- 2238US6232222B1Method of eliminating a critical mask using a blockout mask and a resulting semiconductor structureIBM·Filed 1999·Granted May 15, 2001·6 cites·16 claims
- 2328US6775736B2Embedded DRAM system having wide data bandwidth and data transfer data protocolIBM·Filed 2002·Granted Aug 10, 2004·0 cites·29 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →