Inventor · disambiguated record
Jen-Hsiang Tsai
Also filed as: TSAI JEN-HSIANG
1 granted patent·2 pending applications·8 citations·filing 2006–2023
30Inventor score
Top patents by PatentIndex Score
3 records- 0173US8877647B2Patterning method and method of forming memory deviceWINBOND ELECTRONICS CORP·Filed 2013·Granted Nov 4, 2014·8 cites·30 claims
- 0255US2024189860A1Curing device and curing apparatusFULIAN YUZHAN PRECISION TECH CO LTD·Filed 2023·Application pending·0 cites
- 0332US2008070408A1Method for adjusting sizes and shapes of plug openingsLIN CHIN-LUNG·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →