Inventor · disambiguated record
Jeng-Yu Tsai
Also filed as: TSAI JENG-YU
8 granted patents·3 pending applications·15 citations·filing 2006–2022
78Inventor score
Top patents by PatentIndex Score
11 records- 0192US9477148B1Polymer, method for preparing the same, and a photosensitive resin composition thereofIND TECH RES INST·Filed 2015·Granted Oct 25, 2016·6 cites·16 claims
- 0279US7374861B2Negative photoresist compositionIND TECH RES INST·Filed 2006·Granted May 20, 2008·6 cites·10 claims
- 0377US8420745B2Thermally curable solder resist compositionJENG JHY-LONG·Filed 2011·Granted Apr 16, 2013·3 cites·13 claims
- 0464US12415893B2Anhydride compound, polyimide, and thin filmIND TECH RES INST·Filed 2022·Granted Sep 16, 2025·0 cites·9 claims
- 0560US11746083B2Compound, resin composition and laminated substrate thereofIND TECH RES INST·Filed 2020·Granted Sep 5, 2023·0 cites·15 claims
- 0651US11118082B2Composition, insulating material, and method for preparing an insulating materialIND TECH RES INST·Filed 2018·Granted Sep 14, 2021·0 cites·20 claims
- 0751US2022204697A1Polymer and resin composition thereofIND TECH RES INST·Filed 2020·Application pending·0 cites
- 0849US9169357B2Polyimide copolymers and method for fabricating patterned metal oxide layersJENG JHY-LONG·Filed 2011·Granted Oct 27, 2015·0 cites·16 claims
- 0948US10316182B2Low dielectric constant and solventless resin composition and substrate structureIND TECH RES INST·Filed 2015·Granted Jun 11, 2019·0 cites·7 claims
- 1048US2010167205A1Thermally curable solder resist compositionIND TECH RES INST·Filed 2009·Application pending·0 cites
- 1134US2018179424A1Adhesive composition and composite substrate employing the sameIND TECH RES INST·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →