Inventor · disambiguated record
Jen Feng Tseng
Also filed as: TSENG JEN F · TSENG JEN FENG
1 granted patent·4 pending applications·8 citations·filing 2007–2008
30Inventor score
Top patents by PatentIndex Score
5 records- 0168US8013434B2Thin double-sided package substrate and manufacture method thereofLIGHT OCEAN TECHNOLOGY CORP·Filed 2008·Granted Sep 6, 2011·8 cites·10 claims
- 0238US2008135939A1Fabrication method of semiconductor package and structure thereofLIN CHI CHIH·Filed 2007·Application pending·0 cites
- 0337US2008182360A1Fabrication method of semiconductor packageLIN CHI CHIH·Filed 2007·Application pending·0 cites
- 0433US2009294952A1Chip package carrier and fabrication method thereofTAIWAN SOLUTIONS SYSTEMS CORP·Filed 2008·Application pending·0 cites
- 0531US2007228541A1Method for fabricating chip package structureTAIWAN SOLUTIONS SYSTEMS CORP·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →