Inventor · disambiguated record
Jen-Te Tseng
Also filed as: TSENG JEN-TE
3 granted patents·40 citations·filing 2003–2007
66Inventor score
Top patents by PatentIndex Score
3 records- 0180US6946601B1Electronic package with passive componentsVIA TECH INC·Filed 2004·Granted Sep 20, 2005·34 cites·25 claims
- 0250US6919628B2Stack chip package structureVIA TECH INC·Filed 2003·Granted Jul 19, 2005·6 cites·15 claims
- 0342US7667303B2Multi-chip packageADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Feb 23, 2010·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →