Inventor · disambiguated record
Jen Hung Wang
Also filed as: WANG JEN-HUNG
34 granted patents·20 pending applications·64 citations·filing 2006–2025
95Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD38LIVEN SPORTS MFG XIAMEN CO LTD5WANG JEN-HUNG5LAI KUANG-CHIEH2MACRONIX INT CO LTD2
Top patents by PatentIndex Score
54 records- 0195US10685873B2Etch stop layer for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 16, 2020·10 cites·20 claims
- 0294US10468297B1Metal-based etch-stop layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 5, 2019·8 cites·20 claims
- 0391US11344764B2Weight training deviceLIVEN SPORTS MFG XIAMEN CO LTD·Filed 2020·Granted May 31, 2022·5 cites·9 claims
- 0490US11004734B2Metal-based etch-stop layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 11, 2021·4 cites·20 claims
- 0589US11344777B2Foldable basketball standLIVEN SPORTS MFG XIAMEN CO LTD·Filed 2020·Granted May 31, 2022·4 cites·2 claims
- 0689US7688577B2External box with shockproofing mechanismCOOLER MASTER CO LTD·Filed 2007·Granted Mar 30, 2010·10 cites·14 claims
- 0787US2025364328A1Self-aligned scheme for semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0885US11901228B2Self-aligned scheme for semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 13, 2024·1 cites·20 claims
- 0984US12315726B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted May 27, 2025·0 cites·20 claims
- 1084US11282742B2Semiconductor device with multi-layer etch stop structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 22, 2022·2 cites·20 claims
- 1184US2025343073A1Interconnect structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1283US2025323097A1Semiconductor device and methodTAIWAN SEMICONDUCTOR MANUFACRING CO LTD·Filed 2025·Application pending·0 cites
- 1382US12198979B2Semiconductor device with multi-layer etch stop structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 14, 2025·0 cites·20 claims
- 1482US11651993B2Etch stop layer for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 16, 2023·1 cites·20 claims
- 1582USD932571SKettlebellLIVEN SPORTS MFG XIAMEN CO LTD·Filed 2020·Granted Oct 5, 2021·10 cites·1 claims
- 1682US10727045B2Method for manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 28, 2020·2 cites·20 claims
- 1781US12255095B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 18, 2025·0 cites·20 claims
- 1880US11278781B2Foldable basketball standLIVEN SPORTS MFG XIAMEN CO LTD·Filed 2020·Granted Mar 22, 2022·2 cites·7 claims
- 1979US12476146B2Self-aligned scheme for semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 2079US2024387252A1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2179US2024387268A1Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2278US2024387253A1Interconnect Structures and Methods of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2377US12451393B2Etch stop layer for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 21, 2025·0 cites·20 claims
- 2477US10361112B2High aspect ratio gap fillTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 23, 2019·2 cites·20 claims
- 2577US2025336721A1Interconnect Structure and Method of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2676US12237224B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 25, 2025·0 cites·20 claims
- 2775US2024379541A1Nitrogen Plasma Treatment For Improving Interface Between Etch Stop Layer And Copper InterconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2874US11848231B2Method for forming semiconductor device with multi-layer etch stop structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 19, 2023·0 cites·20 claims
- 2974US11322396B2Etch stop layer for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 3, 2022·1 cites·20 claims
- 3073US12347726B2Interconnect structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 1, 2025·0 cites·20 claims
- 3173US11948798B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 2, 2024·0 cites·20 claims
- 3273US11769693B2Metal-based etch-stop layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 26, 2023·0 cites·20 claims
- 3372US12159830B2Nitrogen plasma treatment for improving interface between etch stop layer and copper interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 3, 2024·0 cites·20 claims
- 3472US10867794B2Patterning method for semiconductor devices and structures resulting therefromTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·1 cites·20 claims
- 3571US11670546B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 6, 2023·0 cites·20 claims
- 3669US2023253247A1Interconnect structure with dielectric cap layer and etch stop layer stackTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3768US12438041B2Interconnect structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 7, 2025·0 cites·20 claims
- 3868US12230567B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 18, 2025·0 cites·20 claims
- 3968US11658064B2Interconnect structure with dielectric cap layer and etch stop layer stackTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 23, 2023·0 cites·20 claims
- 4065US11069528B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 20, 2021·0 cites·20 claims
- 4164US2025149438A1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4263US2020357634A1Method for Manufacturing a Semiconductor DeviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Application pending·0 cites
- 4358US2025214671A1Multifunctional wheeled vehicleLIVEN SPORTS MFG XIAMEN CO LTD·Filed 2023·Application pending·0 cites
- 4457US10391357B2Height adjustable aerobic stepWANG JEN HUNG·Filed 2017·Granted Aug 27, 2019·1 cites·7 claims
- 4555US2011088765A1Solar Cell StructureLAI KUANG-CHIEH·Filed 2009·Application pending·0 cites
- 4654US2024266279A1Conductive structure in semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4751US11532548B2Nitrogen plasma treatment for improving interface between etch stop layer and copper interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 20, 2022·0 cites·20 claims
- 4851US2012017982A1Thin Film Silicon Solar Cell and Manufacturing Method ThereofLAI KUANG-CHIEH·Filed 2011·Application pending·0 cites
- 4950US8191219B2Assembly mechanism for external boxWANG JEN-HUNG·Filed 2007·Granted Jun 5, 2012·0 cites·12 claims
- 5045US2008037215A1External box structure with inner and outer tracksWANG JEN-HUNG·Filed 2007·Application pending·0 cites
Showing the top 50 of 54 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →