Inventor · disambiguated record
Jeffrey Alan West
Also filed as: WEST JEFFREY · WEST JEFFREY A · WEST JEFFREY ALAN
85 granted patents·31 pending applications·829 citations·filing 1984–2025
99Inventor score
Files withTEXAS INSTRUMENTS INC82THERM O DISC INC14WEST JEFFREY A7WEST JEFFREY ALAN7BRIGHTON JEFFREY E1
Top patents by PatentIndex Score
116 records- 0198US9299697B2High breakdown voltage microelectronic device isolation structure with improved reliabilityTEXAS INSTRUMENTS INC·Filed 2014·Granted Mar 29, 2016·50 cites·9 claims
- 0297US9583558B2High breakdown voltage microelectronic device isolation structure with improved reliabilityTEXAS INSTRUMENTS INC·Filed 2016·Granted Feb 28, 2017·17 cites·20 claims
- 0396US11784212B2Standalone high voltage galvanic isolation capacitorsTEXAS INSTRUMENTS INC·Filed 2020·Granted Oct 10, 2023·4 cites·24 claims
- 0495US10147784B2High voltage galvanic isolation deviceTEXAS INSTRUMENTS INC·Filed 2017·Granted Dec 4, 2018·11 cites·20 claims
- 0595US8298944B1Warpage control for die with protruding TSV tips during thermo-compressive bondingWEST JEFFREY ALAN·Filed 2011·Granted Oct 30, 2012·36 cites·20 claims
- 0695US8039385B1IC devices having TSVS including protruding tips having IMC blocking tip endsTEXAS INSTRUMENTS INC·Filed 2010·Granted Oct 18, 2011·22 cites·9 claims
- 0795US6521975B1Scribe street seals in semiconductor devices and method of fabricationTEXAS INSTRUMENTS INC·Filed 2000·Granted Feb 18, 2003·106 cites·17 claims
- 0894US11024576B1Semiconductor package with underfill between a sensor coil and a semiconductor dieTEXAS INSTRUMENTS INC·Filed 2019·Granted Jun 1, 2021·11 cites·29 claims
- 0994US10366958B2Wire bonding between isolation capacitors for multichip modulesTEXAS INSTRUMENTS INC·Filed 2017·Granted Jul 30, 2019·10 cites·20 claims
- 1094US8097964B2IC having TSV arrays with reduced TSV induced stressWEST JEFFREY ALAN·Filed 2009·Granted Jan 17, 2012·39 cites·17 claims
- 1194US6620343B1PTC conductive composition containing a low molecular weight polyethylene processing aidTHERM O DISC INC·Filed 2002·Granted Sep 16, 2003·33 cites·46 claims
- 1293US10109574B1Structure and method for improving high voltage breakdown reliability of a microelectronic deviceTEXAS INSTRUMENTS INC·Filed 2017·Granted Oct 23, 2018·7 cites·21 claims
- 1393US9768245B2High breakdown voltage microelectronic device isolation structure with improved reliabilityTEXAS INSTRUMENTS INC·Filed 2016·Granted Sep 19, 2017·8 cites·20 claims
- 1493US8294261B2Protruding TSV tips for enhanced heat dissipation for IC devicesMAWATARI KAZUAKI·Filed 2010·Granted Oct 23, 2012·37 cites·19 claims
- 1593US7943514B2Integrated circuits having TSVs including metal gettering dielectric linersTEXAS INSTRUMENTS INC·Filed 2009·Granted May 17, 2011·25 cites·14 claims
- 1692US6841455B2Scribe street seals in semiconductor devices and method of fabricationTEXAS INSTRUMENTS INC·Filed 2002·Granted Jan 11, 2005·66 cites·16 claims
- 1791US11532693B2Passive components with improved characteristicsTEXAS INSTRUMENTS INC·Filed 2021·Granted Dec 20, 2022·4 cites·14 claims
- 1890US12241810B2Sensor assemblyTHERM O DISC INC·Filed 2022·Granted Mar 4, 2025·1 cites·11 claims
- 1990US9525021B2Methods and apparatus for high voltage integrated circuit capacitorsTEXAS INSTRUMENTS INC·Filed 2015·Granted Dec 20, 2016·6 cites·18 claims
- 2090US8344493B2Warpage control features on the bottomside of TSV die lateral to protruding bottomside tipsTEXAS INSTRUMENTS INC·Filed 2011·Granted Jan 1, 2013·14 cites·11 claims
- 2190US8143704B2Electronic assemblies including mechanically secured protruding bonding conductor jointsWEST JEFFREY A·Filed 2009·Granted Mar 27, 2012·19 cites·12 claims
- 2289US8575758B2Laser-assisted cleaving of a reconstituted wafer for stacked die assembliesWEST JEFFREY ALAN·Filed 2011·Granted Nov 5, 2013·10 cites·9 claims
- 2388US12276575B2Sensor assembly and refrigerant sensing systemTHERM O DISC INC·Filed 2022·Granted Apr 15, 2025·1 cites·20 claims
- 2488US11348883B2High voltage isolation barrier with electric overstress integrityTEXAS INSTRUMENTS INC·Filed 2020·Granted May 31, 2022·2 cites·20 claims
- 2588US8299612B2IC devices having TSVS including protruding tips having IMC blocking tip endsWEST JEFFREY A·Filed 2011·Granted Oct 30, 2012·9 cites·12 claims
- 2687US9741787B2Methods and apparatus for high voltage integrated circuit capacitorsTEXAS INSTRUMENTS INC·Filed 2016·Granted Aug 22, 2017·4 cites·11 claims
- 2787US8378495B2Integrated circuit (IC) having TSVS with dielectric crack suppression structuresTEXAS INSTRUMENTS INC·Filed 2009·Granted Feb 19, 2013·16 cites·22 claims
- 2885US8227839B2Integrated circuit having TSVS including hillock suppressionWEST JEFFREY ALAN·Filed 2010·Granted Jul 24, 2012·9 cites·13 claims
- 2984US11049820B2Crack suppression structure for HV isolation componentTEXAS INSTRUMENTS INC·Filed 2018·Granted Jun 29, 2021·3 cites·13 claims
- 3084US7708947B2Methods of minimizing temperature cross-sensitivity in vapor sensors and compositions thereforTHERM O DISC INC·Filed 2005·Granted May 4, 2010·10 cites·17 claims
- 3183US8912076B2Crack deflector structure for improving semiconductor device robustness against saw-induced damageWEST JEFFREY ALAN·Filed 2009·Granted Dec 16, 2014·11 cites·12 claims
- 3283US8309957B2Replacement of scribeline padframe with saw-friendly designCHATTERJEE BASAB·Filed 2010·Granted Nov 13, 2012·11 cites·12 claims
- 3383US8125053B2Embedded scribe lane crack arrest structure for improved IC package reliability of plastic flip chip devicesWEST JEFFREY A·Filed 2009·Granted Feb 28, 2012·15 cites·12 claims
- 3483US8125054B2Semiconductor device having enhanced scribe and method for fabricationWEST JEFFREY ALAN·Filed 2009·Granted Feb 28, 2012·20 cites·20 claims
- 3582US12355025B2Standalone isolation capacitorTEXAS INSTRUMENTS INC·Filed 2023·Granted Jul 8, 2025·0 cites·20 claims
- 3682US6358849B1Integrated circuit interconnect and methodTEXAS INSTRUMENTS INC·Filed 1999·Granted Mar 19, 2002·66 cites·5 claims
- 3781US9704804B1Oxidation resistant barrier metal process for semiconductor devicesTEXAS INSTRUMENTS INC·Filed 2015·Granted Jul 11, 2017·4 cites·20 claims
- 3881US8304893B2Integrated circuits having TSVs including metal gettering dielectric linersWEST JEFFREY A·Filed 2011·Granted Nov 6, 2012·5 cites·12 claims
- 3980US2025294783A1Standalone isolation capacitorTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 4079US12230669B2Standalone high voltage galvanic isolation capacitorsTEXAS INSTRUMENTS INC·Filed 2023·Granted Feb 18, 2025·0 cites·18 claims
- 4177US8623763B2Protective layer for protecting TSV tips during thermo-compressive bondingWEST JEFFREY ALAN·Filed 2011·Granted Jan 7, 2014·4 cites·32 claims
- 4276US10679935B2Structure and method for improving high voltage breakdown reliability of a microelectronic deviceTEXAS INSTRUMENTS INC·Filed 2019·Granted Jun 9, 2020·1 cites·18 claims
- 4376US10418320B2Structure and method for improving high voltage breakdown reliability of a microelectronic deviceTEXAS INSTRUMENTS INC·Filed 2018·Granted Sep 17, 2019·1 cites·25 claims
- 4476US6584940B1Flue pipe controlTHERM O DISC INC·Filed 2002·Granted Jul 1, 2003·24 cites·24 claims
- 4576US6197220B1Conductive polymer compositions containing fibrillated fibers and devicesTHERM O DISC CORP·Filed 2000·Granted Mar 6, 2001·16 cites·38 claims
- 4674US11961879B2IC including capacitor having segmented bottom plateTEXAS INSTRUMENTS INC·Filed 2023·Granted Apr 16, 2024·0 cites·20 claims
- 4774US10707297B2High voltage galvanic isolation deviceTEXAS INSTRUMENTS INC·Filed 2018·Granted Jul 7, 2020·1 cites·21 claims
- 4874US2025194119A1Standalone high voltage galvanic isolation capacitorsTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 4973US12495614B2Stabilizing dielectric stress in a galvanic isolation deviceTEXAS INSTRUMENTS INC·Filed 2022·Granted Dec 9, 2025·0 cites·20 claims
- 5073US8859414B2Electronic assemblies including mechanically secured protruding bonding conductor jointsWEST JEFFREY A·Filed 2012·Granted Oct 14, 2014·3 cites·15 claims
Showing the top 50 of 116 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →