Inventor · disambiguated record
Jeng-Sian Wu
Also filed as: WU JENG-SIAN
0 granted patents·4 pending applications·0 citations·filing 2022–2024
Files withPANJIT INT INC4
Top patents by PatentIndex Score
4 records- 0152US2025239499A1Ultra-thin packaged componentPANJIT INT INC·Filed 2024·Application pending·0 cites
- 0251US2024387350A1Package with embedded tracesPANJIT INT INC·Filed 2023·Application pending·0 cites
- 0348US2025069974A1Wafer level packaging component having side wettable structurePANJIT INT INC·Filed 2023·Application pending·0 cites
- 0443US2023395465A1Semiconductor package with solderable sidewallPANJIT INT INC·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →