Inventor · disambiguated record
Jen-Chin Wu
Also filed as: WU JEN C · WU JEN-CHIN
2 granted patents·7 pending applications·4 citations·filing 2003–2008
46Inventor score
Top patents by PatentIndex Score
9 records- 0157US7270732B2Method for enhancing bonding strength of a metal spraying thickened layer of electroformed mold insertsCHUNG SHAN INST OF SCIENCE·Filed 2004·Granted Sep 18, 2007·3 cites·17 claims
- 0255US2010028652A1Metal structure with anti-erosion wear-proof and manufactured method thereofCHUNG SHAN INST OF SCIENCE·Filed 2008·Application pending·0 cites
- 0341US7117577B2Method of fastening mold shell with mold seat without risk of causing mold shell to crackCHUNG SHAN INST OF SCIENCE·Filed 2003·Granted Oct 10, 2006·1 cites·9 claims
- 0438US2010122515A1Poison-filter material and production method thereofKUO HAN-WEN·Filed 2008·Application pending·0 cites
- 0538US2006086614A1Reinforced and thickened mold insert and method of manufacturing the sameCHANG CHIA-HUA·Filed 2004·Application pending·0 cites
- 0637US2007039826A1Thickening method of an electroforming shimCHANG CHIA-HUA·Filed 2005·Application pending·0 cites
- 0732US2005281956A1Thermal spraying method for manufacturing anti-sliding plateCHANG CHIA-HUA·Filed 2004·Application pending·0 cites
- 0832US2007041097A1Method for fabricating a micro-lens mold and a concave micro-lensWU JEN-CHIN·Filed 2005·Application pending·0 cites
- 0923US2005101133A1Method for making negative thermal expansion material zirconium tungstateFiled 2003·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Jen-Chin Wu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →