Inventor · disambiguated record
Je-In Yu
Also filed as: YU JE IN
9 granted patents·5 pending applications·24 citations·filing 2007–2024
83Inventor score
Top patents by PatentIndex Score
14 records- 0190US9836663B2User authenticating method and head mounted device supporting the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Dec 5, 2017·8 cites·19 claims
- 0284US10346601B2Biometric information acquisition method and device for sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jul 9, 2019·8 cites·11 claims
- 0382US10867023B2Wearable device and method of operating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Dec 15, 2020·3 cites·20 claims
- 0482US10552598B2Wearable device and method of operating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 4, 2020·2 cites·20 claims
- 0578US10235510B2Wearable device and method of operating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Mar 19, 2019·2 cites·20 claims
- 0665US12469944B2Waveguide package, method of manufacturing the same, and package housingKOREA ELECTRONICS TECHNOLOGY·Filed 2022·Granted Nov 11, 2025·0 cites·13 claims
- 0761US10318806B2Method and device for irradiating light for photographing irisSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jun 11, 2019·1 cites·18 claims
- 0859US2024282724A1Antenna-integrated high-frequency semiconductor package and method of manufacturing sameKOREA ELECTRONICS TECHNOLOGY·Filed 2024·Application pending·0 cites
- 0959US2025192745A1Millimeter-wave band lc filterKOREA ELECTRONICS TECHNOLOGY·Filed 2024·Application pending·0 cites
- 1055US12014881B2High frequency capacitor and manufacturing method thereofKOREA ELECTRONICS TECHNOLOGY·Filed 2022·Granted Jun 18, 2024·0 cites·11 claims
- 1152US2023107554A1Semiconductor package and manufacturing method thereofKOREA ELECTRONICS TECHNOLOGY·Filed 2022·Application pending·0 cites
- 1248US2015084936A1Method and apparatus for drawing three-dimensional objectSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 1342US2010326707A1Methal-based package substrate, three-dimensional multi-layered package module using the same, and manufacturing method thereofWAVENICS INC·Filed 2007·Application pending·0 cites
- 1439US9960632B2Method and apparatus for controlling booster circuit and apparatus for extracting maximum power by using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted May 1, 2018·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →