Inventor · disambiguated record
Jheng-Hong Jiang
Also filed as: JIANG JHENG-HONG
23 granted patents·20 pending applications·12 citations·filing 2017–2025
91Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD43
Top patents by PatentIndex Score
43 records- 0193US11489011B2Resistive random access memory deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 1, 2022·4 cites·20 claims
- 0287US12396179B2Resistive random access memory deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 19, 2025·0 cites·20 claims
- 0387US2025344405A1Novel resistive random access memory deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0486US2025364396A1Variable graduated capacitor structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0585US2025361139A1Impact-resistant micromechanical armsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0683US11011576B2Resistive random access memory deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 18, 2021·4 cites·20 claims
- 0783US9997628B1Semiconductor device and method of fabricating thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 12, 2018·4 cites·20 claims
- 0883US2025356104A1Hybrid Node Chiplet Stacking DesignTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0979US12400947B2Variable graduated capacitor structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 26, 2025·0 cites·20 claims
- 1079US2025132258A1Plasma-damage-resistant interconnect structure and methods for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1178US12205901B2Plasma-damage-resistant interconnect structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 21, 2025·0 cites·20 claims
- 1278US12131915B2Pit-less chemical mechanical planarization process and device structures made therefromTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 29, 2024·0 cites·20 claims
- 1378US11950433B2Resistive random access memory deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 2, 2024·0 cites·20 claims
- 1478US2024395739A1Cavity resonator for enhancing radio-frequency performance and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1578US2024379379A1Pit-less chemical mechanical planarization process and device structures made therefromTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1677US12237280B2Cavity resonator for enhancing radio-frequency performance and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 25, 2025·0 cites·20 claims
- 1775US12448279B2Semiconductor structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 21, 2025·0 cites·20 claims
- 1874US12415718B2Impact-resistant micromechanical armsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 16, 2025·0 cites·20 claims
- 1974US2024338507A1Hybrid Node Chiplet Stacking DesignTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2074US2024339366A1Semiconductor structure and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2174US2024387262A1Metal interconnect structures and methods of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2272US12039244B2Hybrid node chiplet stacking designTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 16, 2024·0 cites·20 claims
- 2372US11848291B2Cavity resonator for enhancing radio-frequency performance and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 19, 2023·0 cites·20 claims
- 2471US12453298B2Resistive random access memory deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 21, 2025·0 cites·20 claims
- 2571US2024379746A1Thermoelectric cooling of semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2670US11728272B2Plasma-damage-resistant interconnect structure and methods for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 15, 2023·0 cites·20 claims
- 2770US2024086137A1Near eye display apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2869US12261129B2Damping device and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 25, 2025·0 cites·20 claims
- 2969US12191247B2Variable graduated capacitor structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 7, 2025·0 cites·20 claims
- 3069US11914915B2Near eye display apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 27, 2024·0 cites·20 claims
- 3169US2025218980A1Damping device and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3268US11705340B2Pit-less chemical mechanical planarization process and device structures made therefromTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 18, 2023·0 cites·20 claims
- 3367US12027431B2Semiconductor structure and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 2, 2024·0 cites·20 claims
- 3466US12261199B2Thermoelectric cooling of semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 25, 2025·0 cites·20 claims
- 3566US11892639B2Display device having display area with luminous pixels over curved surface of semiconductor substrate for use in near-eye displayTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 6, 2024·0 cites·20 claims
- 3661US12239034B2Resistive random access memory device having needle-like-shaped top electrode region and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 25, 2025·0 cites·20 claims
- 3761US2023069716A1Metal interconnect structures and methods of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Application pending·0 cites
- 3859US2025233014A1Semiconductor device structure and method of fabricating sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3959US2025233016A1Semiconductor device and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4059US2025253189A1Semiconductor device structure and method of fabricating sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4157US2024038949A1Light-emitting package and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 4257US2024081105A1Display devices with stray light prevention mechanismsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4353US2024063338A1Curved semiconductor chip and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →